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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TLP3403SRHA
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| Description |
Photorelay (MOSFET output, 1-form-a), 20 V/1.5 A, 500 Vrms, S-VSON4T
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
70430-167LF
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| Description |
Metral® Power Connectors, Backplane Power Connectors, 5 Row Power Header,Vertical Press-Fit, Wide body.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
51730-167LF
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| Description |
PwrBlade®, Power Supply Connectors, 3P 24S 3P Right Angle Header.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68016-702HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 2 Positions, 2.54 mm (0.100) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
52610-1672 0526101672
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| Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 16 Circuits, Lead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 16 Circuits, Lead-free, High Barrier Packaging
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| File Size |
523.95K /
8 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
59132-F34-03-075
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| Description |
Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 6 Positions, 2.00mm (0.079in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
52610-1671 0526101671
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| Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 16 CircuitsLead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 16 CircuitsLead-free, High Barrier Packaging
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| File Size |
504.02K /
9 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
59132-G34-03-050LF
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| Description |
Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 6 Positions, 2.00mm (0.079in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
RJE1R288223403
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| Description |
Modular Jacks, Input Output Connectors, 8P8C, Cat5e, Stacked, Shield, No LEDs
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77315-134-03LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
59132-S34-03-094LF
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| Description |
Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 6 Positions, 2.00mm (0.079in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10137183-4030LF
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| Description |
QSFP Copper Cable Assemblies, 28Gbps, 38 Positions, 26AWG, 4x Channels, 8 Signal Pairs.
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| Tech specs |
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Official Product Page
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Price and Availability
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