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  44067-2201 Datasheet PDF File

For 44067-2201 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    44067-0201 0440670201

Molex Electronics Ltd.
Part No. 44067-0201 0440670201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")

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Texas Instruments

Part No. BQ2201SN-NTR
Description SRAM Nonvolatile Controller IC for 1 SRAM Bank 8-SOIC -40 to 85
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0440671001 44067-1001

Molex Electronics Ltd.
Part No. 0440671001 44067-1001
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
MOLEX Connector

File Size 204.09K  /  3 Page

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Texas Instruments

Part No. JM38510/32201BEA
Description Hex Bus Drivers With 3-State Outputs 16-CDIP -55 to 125
Tech specs    

Official Product Page

    0440672001 44067-2001

Molex Electronics Ltd.
Part No. 0440672001 44067-2001
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 20 Circuits, Tin (Sn) Plating
MOLEX Connector

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Texas Instruments

Part No. TLC2201IDR
Description Low Noise Precision Rail-To-Rail Output Operational Amplifier 8-SOIC
Tech specs    

Official Product Page

    0440671403 44067-1403

Molex Electronics Ltd.
Part No. 0440671403 44067-1403
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti
MOLEX Connector

File Size 204.16K  /  3 Page

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Texas Instruments

Part No. TLC2201AIDG4
Description Advanced LinCMOS&#153; Low-Noise Precision Operational Amplifier 8-SOIC
Tech specs    

Official Product Page

    0440672002 44067-2002

Molex Electronics Ltd.
Part No. 0440672002 44067-2002
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140) Thick PCB, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

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Texas Instruments

Part No. TLC2201AMJGB
Description Low Noise Precision Advanced LinCMOS&#153; Single Operational Amplifier 8-CDIP -55 to 125
Tech specs    

Official Product Page

    0440672402 44067-2402

Molex Electronics Ltd.
Part No. 0440672402 44067-2402
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 204.16K  /  3 Page

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Texas Instruments

Part No. TLK2201BRCPR
Description 1.0 to 1.6 Gigabit Ethernet Transceiver 64-HVQFP 0 to 70
Tech specs    

Official Product Page

    0440671401 44067-1401

Molex Electronics Ltd.
Part No. 0440671401 44067-1401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
MOLEX Connector

File Size 204.10K  /  3 Page

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Texas Instruments

Part No. TNETE2201BPHD
Description 1.25-Gigabit Ethernet Transceiver 64-HTQFP 0 to 70
Tech specs    

Official Product Page

    0440672403 44067-2403

Molex Electronics Ltd.
Part No. 0440672403 44067-2403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 204.16K  /  3 Page

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Texas Instruments

Part No. MSP430G2201IN14
Description MSP430G2x01, MSP430G2x11 Mixed Signal Microcontroller 14-PDIP -40 to 85
Tech specs    

Get Free Sample

Official Product Page

    44067-1603 0440671603

Molex Electronics Ltd.
Part No. 44067-1603 0440671603
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 203.98K  /  3 Page

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Texas Instruments

Part No. LMZ22010TZE/NOPB
Description 10A SIMPLE SWITCHER&#174; Power Module with 20V Maximum Input Voltage and Current Sharing 11-PFM -40 to 85
Tech specs    

Get Free Sample

Official Product Page

    44067-1601 0440671601

Molex Electronics Ltd.
Part No. 44067-1601 0440671601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")

File Size 204.11K  /  3 Page

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Texas Instruments

Part No. V62/06622-01XE
Description Enhanced Product Quadruple Operational Amplifier 14-TSSOP -40 to 125
Tech specs    

Official Product Page

For 44067-2201 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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