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  54775 Datasheet PDF File

For 54775 Found Datasheets File :: 35+       Page :: | 1 | <2> | 3 | 4 |   

    0015477562 15-47-7562

Molex Electronics Ltd.
Part No. 0015477562 15-47-7562
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, Tin (Sn) Plating

File Size 377.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 54775-602-30LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015477564

Molex Electronics Ltd.
Part No. 0015477564
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 64 Circuits, Tin (Sn) Plating

File Size 377.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 54775-602-36LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0754775001

Molex Electronics Ltd.
Part No. 0754775001
Description Small Form-factor Pluggable (SFP) Stacked 2-by-6 Multi-Port Connector with Press-fit PC Tails

File Size 288.18K  /  6 Page

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Amphenol Communications Solutions

Part No. 54775-102-36LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477572

Molex Electronics Ltd.
Part No. 0015477572
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 72 Circuits, Tin (Sn) Plating

File Size 377.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 54775-102-30LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477570

Molex Electronics Ltd.
Part No. 0015477570
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 70 Circuits, Tin (Sn) Plating

File Size 377.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 54775-101-36LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015477568

Molex Electronics Ltd.
Part No. 0015477568
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 68 Circuits, Tin (Sn) Plating

File Size 377.28K  /  4 Page

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    0015477566

Molex Electronics Ltd.
Part No. 0015477566
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 66 Circuits, Tin (Sn) Plating

File Size 377.28K  /  4 Page

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    0015477530-17

Molex Electronics Ltd.
Part No. 0015477530-17
Description    2.54mm Pitch C-Grid Header, Through Hole, Dual Row, Vertical, High Temperature

File Size 20.38K  /  2 Page

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    15-47-7530 0015477530

http://
Molex Electronics Ltd.
Part No. 15-47-7530 0015477530
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, Tin (Sn) Plating

File Size 377.42K  /  4 Page

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    0015477552

Molex Electronics Ltd.
Part No. 0015477552
Description MOLEX Connector

File Size 377.50K  /  4 Page

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For 54775 Found Datasheets File :: 35+       Page :: | 1 | <2> | 3 | 4 |   

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