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Molex Electronics Ltd.
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| Part No. |
0015477562 15-47-7562
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, Tin (Sn) Plating
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| File Size |
377.28K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54775-602-30LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54775-602-36LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54775-102-36LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54775-102-30LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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|
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Official Product Page
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|
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Amphenol Communications Solutions |
| Part No. |
54775-101-36LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header,Through Hole, Double Row, 36 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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http:// Molex Electronics Ltd.
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| Part No. |
15-47-7530 0015477530
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, Tin (Sn) Plating
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| File Size |
377.42K /
4 Page |
View
it Online |
Download Datasheet
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Price and Availability
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