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  52610-0672 Datasheet PDF File

For 52610-0672 Found Datasheets File :: 121+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 |   

    0672983090

Molex Electronics Ltd.
Part No. 0672983090
Description Universal Serial Bus (USB) Shielded I/O Receptacle, Right Angle, Dual Stacked, TypeA, Gold (Au) Flash, Black Housing, with 4 Beveled Metal Pins, Lead Free
MOLEX Connector

File Size 115.90K  /  3 Page

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Texas Instruments

Part No. SN0806723IPNR
Description Single-phase Metering SoC with 2 Sigma-Delta ADCs, LCD, Real-Time Clock, 64KB Flash, 4KB RAM 80-LQFP -40 to 85
Tech specs    

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Official Product Page

HUA FENG CIRCUIT





    0554600672 55460-0672

Molex Electronics Ltd.
Part No. 0554600672 55460-0672
Description 2.00mm (.079) Pitch Mi ll System Wire-to-Board Header, Surface Mount, SingleRow, Vertical, Lead-free, 6 Circuits
MOLEX Connector

File Size 338.39K  /  5 Page

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Texas Instruments

Part No. LM50672NPAR
Description -9-V to -80-V hot swap controller with power limiting 14-SOIC -40 to 125
Tech specs    

Official Product Page

    0440672403 44067-2403

Molex Electronics Ltd.
Part No. 0440672403 44067-2403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 10150526-1011HLF
Description 2.0MM WIRE TO BOARD HEADER
Tech specs    

Official Product Page

    0440672402 44067-2402

Molex Electronics Ltd.
Part No. 0440672402 44067-2402
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 85261-001LF
Description Din Accessory Locking Frame 3x16
Tech specs    

Official Product Page

    0672983091 67298-3091

Molex Electronics Ltd.
Part No. 0672983091 67298-3091
Description Universal Serial Bus (USB) Shielded I/O Receptacle, Right Angle, Dual Stacked, TypeA, 0.76μm (30μ) Gold (Au) Plating, Black Housing, with 4 Beveled Metal Pins, LeadFree
Universal Serial Bus (USB) Shielded I/O Receptacle, Right Angle, Dual Stacked, TypeA, 0.76渭m (30渭") Gold (Au) Plating, Black Housing, with 4 Beveled Metal Pins,
MOLEX Connector

File Size 115.85K  /  3 Page

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Amphenol Communications Solutions

Part No. 93690-106-72LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0440672201 44067-2201

Molex Electronics Ltd.
Part No. 0440672201 44067-2201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
MOLEX Connector

File Size 204.11K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-106721050LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0440672002 44067-2002

Molex Electronics Ltd.
Part No. 0440672002 44067-2002
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for upto 3.56mm (.140) Thick PCB, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 204.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-106720850LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0440672001 44067-2001

Molex Electronics Ltd.
Part No. 0440672001 44067-2001
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 20 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 204.09K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-106721000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 72 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0672320001 67232-0001

Molex Electronics Ltd.
Part No. 0672320001 67232-0001
Description 1.27mm (.050) Pitch One Slot Card Bus Header-Flush Profile, Edge Mount, RightAngle, SMT
MOLEX Connector

File Size 179.11K  /  3 Page

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Amphenol Communications Solutions

Part No. 68020-672
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0526100572

Molex Electronics Ltd.
Part No. 0526100572
Description 1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, Gold (Au Contact Plating, 5 Circuits, Lead-free, High Barrier Packaging

File Size 523.84K  /  8 Page

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Amphenol Communications Solutions

Part No. 76745-106-72LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 52610-0672 Found Datasheets File :: 121+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 |   

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