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  4221-1 Datasheet PDF File

For 4221-1 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    CYPRESS SEMICONDUCTOR CORP
Part No. CY7C4221V-35JCR
Description 1K X 9 OTHER FIFO, PQCC32

File Size 633.15K  /  15 Page

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Amphenol Communications Solutions

Part No. 10131319-04221G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 4 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0878334221 87833-4221

Molex Electronics Ltd.
Part No. 0878334221 87833-4221
Description 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Shrouded, Lead-free, 42 Circuits, 0.76μm (30μ) Gold (Au) Plating, without PCB Locator, with Locking Windows

File Size 256.32K  /  4 Page

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Amphenol Communications Solutions

Part No. 10131318-24221G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Bright Tin plating, Black Color, 24 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    0878314221 87831-4221

Molex Electronics Ltd.
Part No. 0878314221 87831-4221
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Vertical, Through Hole, Shrouded, Lead-free, 42 Circuits, 0.76μm (30μ) Gold (Au) Plating, Center Polarization Slot
Molex Electronics Ltd.

File Size 218.34K  /  4 Page

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Amphenol Communications Solutions

Part No. 10137784-04221LF
Description Minitek® Pwr 4.2 HCC, Single Row, Right Angle Through Hole Header, Nylon 66, Gold Flash plating, Black Color, 4 Positions, GW Compatible, Tray packing.
Tech specs    

Official Product Page

    0736442217

Molex Electronics Ltd.
Part No. 0736442217
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits

File Size 174.55K  /  4 Page

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Amphenol Communications Solutions

Part No. 77313-422-18LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 18 Positions
Tech specs    

Official Product Page

    0942422118 94242-2118

Molex Electronics Ltd.
Part No. 0942422118 94242-2118
Description 2.54mm (.100) Pitch, MOX Header, 3.50mm (.137) Grid, Through Hole
2.54mm (.100") Pitch, MOX Header, 3.50mm (.137") Grid, Through Hole

File Size 115.93K  /  3 Page

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Amphenol Communications Solutions

Part No. 68422-105HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 5 Positions, 2.54mm Pitch, Vertical, 8.08mm (0.318in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

    0739442216

Molex Electronics Ltd.
Part No. 0739442216
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, SolderGuide Pin Option, 72 Circuits

File Size 153.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 68422-134HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54mm Pitch, Vertical, 8.08mm (0.318in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

    73644-2210 0736442210

Molex Electronics Ltd.
Part No. 73644-2210 0736442210
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position F, 72 Circuits
2.00mm (.079") Pitch HDM垄莽 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position F, 72 Circuits

File Size 174.19K  /  4 Page

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Amphenol Communications Solutions

Part No. 68422-126HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54mm Pitch, Vertical, 8.08mm (0.318in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

    87914-2216 0879142216

Molex Electronics Ltd.
Part No. 87914-2216 0879142216
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.50K  /  48 Page

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Amphenol Communications Solutions

Part No. 68422-102HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 2 Positions, 2.54mm Pitch, Vertical, 8.08mm (0.318in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

    0015474221

Molex Electronics Ltd.
Part No. 0015474221
Description
File Size 135.19K  /  3 Page

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Amphenol Communications Solutions

Part No. G823MB14221KEU
Description Board mount - Header Plug - Box Header 2.0mm Pitch Vertical,SMT,2x7Pin,15u\\ Gold,NY4T,With Location Post,With CAP
Tech specs    

Official Product Page

    0736442214

Molex Electronics Ltd.
Part No. 0736442214
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position H, 72 Circuits

File Size 174.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 10131319-0422100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 4 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

For 4221-1 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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