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Amphenol Communications Solutions |
Part No. |
10131319-04221G0LF
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Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 4 Positions, GW Compatible Nylon66, Tray Packing.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10131318-24221G0LF
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Description |
Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Bright Tin plating, Black Color, 24 Positions, GW Compatible Nylon66, Tray Packing.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10137784-04221LF
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Description |
Minitek® Pwr 4.2 HCC, Single Row, Right Angle Through Hole Header, Nylon 66, Gold Flash plating, Black Color, 4 Positions, GW Compatible, Tray packing.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77313-422-18LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 18 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68422-105HLF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 5 Positions, 2.54mm Pitch, Vertical, 8.08mm (0.318in) Mating, 5.41mm (0.213in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68422-134HLF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54mm Pitch, Vertical, 8.08mm (0.318in) Mating, 5.41mm (0.213in) Tail.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
73644-2210 0736442210
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Description |
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position F, 72 Circuits 2.00mm (.079") Pitch HDM垄莽 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position F, 72 Circuits
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File Size |
174.19K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68422-126HLF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54mm Pitch, Vertical, 8.08mm (0.318in) Mating, 5.41mm (0.213in) Tail.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
87914-2216 0879142216
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68422-102HLF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 2 Positions, 2.54mm Pitch, Vertical, 8.08mm (0.318in) Mating, 5.41mm (0.213in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
G823MB14221KEU
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Description |
Board mount - Header Plug - Box Header 2.0mm Pitch Vertical,SMT,2x7Pin,15u\\ Gold,NY4T,With Location Post,With CAP
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10131319-0422100LF
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Description |
Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 4 Positions, Non GW Compatible Nylon66, Tray Packing.
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Tech specs |
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Official Product Page
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Bom2Buy.com

Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
Part: 42011500000 |
Maker: WICKMANN |
Pack: N/A |
Stock: 4016 |
Unit price
for : |
50: $0.10 |
100: $0.09 |
1000:
$0.09 |
Email: oulindz@gmail.com |
Contact us |
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