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Texas Instruments |
| Part No. |
TLV707135DQNT
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| Description |
200mA Low-Iq Low-Noise Low-Dropout (LDO) Regulator for Portable Devices 4-X2SON -40 to 85
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713085404 71308-5404
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs
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| File Size |
1,475.56K /
8 Page |
 View
it Online |
Download Datasheet
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Texas Instruments |
| Part No. |
LP590713QDQNRQ1
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| Description |
Automotive, 250-mA, low-noise, high-PSRR, ultra-low-dropout voltage regulator with low IQ and enable 4-X2SON -40 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
TLV707135DQNR
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| Description |
200mA Low-Iq Low-Noise Low-Dropout (LDO) Regulator for Portable Devices 4-X2SON -40 to 85
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| Tech specs |
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Get Free Sample |
Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77315-407-13LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
98426-S04-07-133LF
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| Description |
Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
98426-G04-07-133LF
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| Description |
Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713086470
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 70 Circuits 1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 70 Circuits 1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30
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| File Size |
1,475.71K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
U95Z2054071301
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| Description |
QSFP 2X2 COMBO SP FG NO LP
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713086472
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 72 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 72 Circuits,1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30
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| File Size |
1,475.71K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
89007-136LF
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| Description |
Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713086474
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m
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| File Size |
1,475.71K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77315-107-13LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713086476
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m
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| File Size |
1,475.71K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
U95Z1054071321
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| Description |
QSFP STACKED COMBO NO LP
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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| Part: 0722BG |
| Maker: BB |
| Pack: AUCDIP |
| Stock: Reserved |
| Unit price
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50: $46.15 |
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100: $43.85 |
| 1000:
$41.54 |
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