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  12816 Datasheet PDF File

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    TIANMA
Part No. TM128160GKFWGSPEC
Description LCD_Module

File Size 544.90K  /  27 Page

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Amphenol Communications Solutions

Part No. 54112-816202500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TIANMA
Part No. TM128160DKFWFSPEC
Description LCD_Module

File Size 391.61K  /  26 Page

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Amphenol Communications Solutions

Part No. 54112-816122500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TIANMA
Part No. TM128160EKFWGSPEC
Description LCD_Module

File Size 357.55K  /  23 Page

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Amphenol Communications Solutions

Part No. 54122-128161250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    TIANMA
Part No. TM128160ANFWGSPEC
Description LCD_Module

File Size 654.99K  /  23 Page

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    Mosel Vitelic Corp
Mosel Vitelic, Corp.
Part No. V58C2128164S V58C2128404S V58C2128804S
Description HIGH PERFORMANCE 2.5 VOLT 128 Mbit DDR SDRAM 高性能2.528兆位DDR SDRAM内存

File Size 730.70K  /  59 Page

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    V58C2128 V58C2128164S V58C2128404S V58C2128804S

MOSEL[Mosel Vitelic, Corp]
Part No. V58C2128 V58C2128164S V58C2128404S V58C2128804S
Description HIGH PERFORMANCE 2.5 VOLT 128 Mbit DDR SDRAM

File Size 719.10K  /  59 Page

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    HYB18L128160BC-7.5 HYB18L128160BF-7.5 HYB18L128160BF-75 HYE18L128160BC-75

Infineon Technologies A...
Infineon Technologies AG
Part No. HYB18L128160BC-7.5 HYB18L128160BF-7.5 HYB18L128160BF-75 HYE18L128160BC-75
Description DRAMs for Mobile Applications
Very low Power SDRAM optimized for battery-powered, handheld applications
ECONOLINE: RKZ - Safety standards and approvals: EN 60950 certified, rated for 250VAC (LVD test report)- Custom Solutions Available- 3kVDC & 4kVDC Isolation- UL94V-0 Package Material- Power Sharing on Output- Efficiency to 84%

File Size 1,060.19K  /  53 Page

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    HYB18L128160BC-7.5 HYE18L128160BC-7.5 HYB18L128160BF HYB18L128160BF-7.5 HYE18L128160BF-7.5

Qimonda AG
Part No. HYB18L128160BC-7.5 HYE18L128160BC-7.5 HYB18L128160BF HYB18L128160BF-7.5 HYE18L128160BF-7.5
Description DRAMs for Mobile Applications 128-Mbit Mobile-RAM

File Size 1,430.43K  /  55 Page

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    INFINEON[Infineon Technologies AG]
Part No. HYE18L128160BF-75 HYB18L128160BC-75 HYB18L128160BF HYB18L128160BF-75 HYE18L128160BC-75
Description DRAMs for Mobile Applications

File Size 1,052.01K  /  53 Page

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    HYB39SC128160FE-6 HYI39SC128160FE-6

Qimonda AG
Part No. HYB39SC128160FE-6 HYI39SC128160FE-6
Description 128-MBit Synchronous DRAM 8M X 16 SYNCHRONOUS DRAM, 5.4 ns, PDSO54

File Size 732.36K  /  21 Page

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Part: 128000
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