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  5608 Datasheet PDF File

For 5608 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    HDSP-5503 HDSP-H158 HDSP-5301 HDSP-5303 HDSP-5307 HDSP-5308 HDSP-5321 HDSP-5323 HDSP-5501 HDSP-5507 HDSP-5508 HDSP-5521

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. HDSP-5503 HDSP-H158 HDSP-5301 HDSP-5303 HDSP-5307 HDSP-5308 HDSP-5321 HDSP-5323 HDSP-5501 HDSP-5507 HDSP-5508 HDSP-5521 HDSP-5523 HDSP-5601 HDSP-5603 HDSP-5608 HDSP-5621 HDSP-5623 HDSP-5701 HDSP-5703 HDSP-5707 HDSP-5708 HDSP-5721 HDSP-5723 HDSP-H151 HDSP-H153 HDSP-H157
Description 14.2 mm (0.56 inch) Seven Segment Displays

File Size 242.61K  /  8 Page

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Texas Instruments

Part No. TLV5608IDW
Description 2.7V to 5.5V 10-Bit 8-channel Serial DAC 20-SOIC -40 to 85
Tech specs    

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Official Product Page

HUA FENG CIRCUIT





    Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Part No. K4H560838E-GCCC K4H560438E-GCC4 K4H560438E-GCCC K4H560838E-GCC4
Description DIODE ZENER SINGLE 300mW 27Vz 5mA-Izt 0.02503 0.05uA-Ir 21 SOT-23 3K/REEL 256Mb的电子芯片的DDR 400内存规格60Ball FBGA封装(x4/x8
DIODE ZENER SINGLE 300mW 29.8Vz 5mA-Izt 0.02503 0.05uA-Ir 23 SOT-23 3K/REEL
256Mb E-die DDR 400 SDRAM Specification 60Ball FBGA (x4/x8)

File Size 195.42K  /  18 Page

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Texas Instruments

Part No. TLV5608IPWR
Description 2.7V to 5.5V 10-Bit 8-channel Serial DAC 20-TSSOP -40 to 85
Tech specs    

Official Product Page

    Samsung Semiconductor Co., Ltd.
Part No. K4H560438E-ZLB30 K4H560838E-ZLB30
Description 64M X 4 DDR DRAM, 0.7 ns, PBGA60 ROHS COMPLIANT, FBGA-60
32M X 8 DDR DRAM, 0.7 ns, PBGA60 ROHS COMPLIANT, FBGA-60

File Size 385.02K  /  24 Page

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Texas Instruments

Part No. V62/05608-03YE
Description Enhanced Product Wideband Low-Distortion Fully Differential Amplifier 8-MSOP-PowerPAD -55 to 60
Tech specs    

Official Product Page

    A-7720-WD08F501B 0022456087 22-45-6087

Molex Electronics Ltd.
Part No. A-7720-WD08F501B 0022456087 22-45-6087
Description 2.54mm (.100) KK IDT Double Cantilever Contact, 8 Circuits, Gold (Au), Feed-To, 22 AWG Wire

File Size 476.92K  /  20 Page

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Texas Instruments

Part No. TLV5608IPWRG4
Description 2.7V to 5.5V 10-Bit 8-channel Serial DAC 20-TSSOP -40 to 85
Tech specs    

Official Product Page

    A-7720-WC08F501B 0022456086 22-45-6086

Molex Electronics Ltd.
Part No. A-7720-WC08F501B 0022456086 22-45-6086
Description 2.54mm (.100) KK? IDT Double Cantilever Contact, 8 Circuits, Gold (Au), FeedThrough, 22 AWG Wire

File Size 484.66K  /  20 Page

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Texas Instruments

Part No. V62/15608-01XE
Description 3.3-V Supply RS-485 With IEC ESD Protection 8-SON -55 to 125
Tech specs    

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    A-7720-WA08F501B 0022456081 22-45-6081

Molex Electronics Ltd.
Part No. A-7720-WA08F501B 0022456081 22-45-6081
Description 2.54mm (.100") KK庐 IDT Double Cantilever Contact, 8 Circuits, Gold (Au), Feed-Through, 22 AWG Wire
2.54mm (.100) KK? IDT Double Cantilever Contact, 8 Circuits, Gold (Au), Feed-Through, 22 AWG Wire

File Size 476.94K  /  20 Page

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Texas Instruments

Part No. V62/05608-02YE
Description Enhanced Product Wideband Low-Distortion Fully Differential Amplifier 8-MSOP-PowerPAD -55 to 125
Tech specs    

Official Product Page

    FAIRCHILD[Fairchild Semiconductor]
Part No. FAN5608_06 FAN5608 FAN5608DHMPX FAN560806
Description Serial / Parallel LED Driver with Current-Regulated, Step-Up DC/DC Converter

File Size 362.35K  /  13 Page

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Texas Instruments

Part No. TLV5608IPW
Description 2.7V to 5.5V 10-Bit 8-channel Serial DAC 20-TSSOP -40 to 85
Tech specs    

Get Free Sample

Official Product Page

    Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4H561638F-UC K4H561638F-UC_LB3 K4H560838F-UC_LA2 K4H560838F-UC_LAA K4H560838F-UC_LB0 K4H560838F-UC_LB3 K4H561638F-UC_LA2 K4H561638F-UC_LAA K4H561638F-UC_LB0 K4H560838F-UC/LA2 K4H560838F-UC/LAA K4H560838F-UC/LB0 K4H560838F-UC/LB3 K4H561638F-UC/LA2 K4H561638F-UC/LAA K4H561638F-UC/LB0 K4H561638F-UC/LB3
Description 256Mb F-die DDR SDRAM Specification

File Size 203.61K  /  23 Page

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Texas Instruments

Part No. TLV5608IDWR
Description 2.7V to 5.5V 10-Bit 8-channel Serial DAC 20-SOIC -40 to 85
Tech specs    

Official Product Page

    K4H561638F-TCCC K4H561638F-TCC4 K4H560838F-TC K4H560838F-TCC4 K4H560838F-TCCC

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4H561638F-TCCC K4H561638F-TCC4 K4H560838F-TC K4H560838F-TCC4 K4H560838F-TCCC
Description 256Mb F-die DDR400 SDRAM Specification 256Mb的的F -模具支持DDR400内存规格

File Size 168.74K  /  19 Page

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Amphenol Communications Solutions

Part No. 10136656-0841NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 30u\\ Gold (Tin on Tails) plating, 8 Positions, Natural Color, GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    K4H560838F K4H561638F-UCCC K4H561638F-UCC4 K4H560838F-UC K4H560838F-UCC4 K4H560838F-UCCC

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4H560838F K4H561638F-UCCC K4H561638F-UCC4 K4H560838F-UC K4H560838F-UCC4 K4H560838F-UCCC
Description 256Mb F-die DDR400 SDRAM Specification 256Mb的的F -模具支持DDR400内存规格

File Size 168.93K  /  19 Page

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Amphenol Communications Solutions

Part No. 75160-156-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,8 position, 2.54mm pitch
Tech specs    

Official Product Page

For 5608 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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