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  71764-0204 Datasheet PDF File

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    0717640204 71764-0204

Molex Electronics Ltd.
Part No. 0717640204 71764-0204
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.70K  /  5 Page

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Amphenol Communications Solutions

Part No. 75168-102-04LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 04 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MITEQ INC
Part No. M0204/U
Description 2000 MHz - 4000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER

File Size 456.09K  /  6 Page

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Amphenol Communications Solutions

Part No. 68020-406HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71764-0220

Molex Electronics Ltd.
Part No. 71764-0220
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 120.87K  /  5 Page

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Amphenol Communications Solutions

Part No. 68020-440HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71764-0222

Molex Electronics Ltd.
Part No. 71764-0222
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, DualRow, Right Angle,High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 121.00K  /  5 Page

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Amphenol Communications Solutions

Part No. 68020-410HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71764-0008

Molex Electronics Ltd.
Part No. 71764-0008
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 8 Circuits, Tin (Sn) Plating

File Size 121.06K  /  5 Page

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Amphenol Communications Solutions

Part No. G832MB130204324HR
Description Pitch 0.8mm, Height 6.7 mm, 20 Positions, Dual Row, BTB Vertical Plug SMT, 8u\\. Gold White
Tech specs    

Official Product Page

    71764-0004

Molex Electronics Ltd.
Part No. 71764-0004
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, Tin (Sn) Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, Tin (Sn) Plating

File Size 121.13K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-502-04LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 4 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    71764-0114

Molex Electronics Ltd.
Part No. 71764-0114
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 14 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.23K  /  5 Page

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Amphenol Communications Solutions

Part No. 51740-10204402CALF
Description PwrBlade®, Power Supply Connectors, 2P 44S 2P Vertical Receptacle.
Tech specs    

Official Product Page

    71764-0116

Molex Electronics Ltd.
Part No. 71764-0116
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.10K  /  5 Page

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Amphenol Communications Solutions

Part No. 95293-802-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,4 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    71764-0118

Molex Electronics Ltd.
Part No. 71764-0118
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right Angle, High Temperature, 18 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 120.86K  /  5 Page

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Amphenol Communications Solutions

Part No. 74771-202041LF
Description Metral®, Backplane connectors, 1000 Series Header, Vertical Signal, 8 Row, Press-Fit, 96 Position, Special Load, Standard
Tech specs    

Official Product Page

    71764-0120

Molex Electronics Ltd.
Part No. 71764-0120
Description 2.54mm (.100) Pitch C-Grid? Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 20 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating

File Size 121.16K  /  5 Page

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Amphenol Communications Solutions

Part No. 68020-442HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 42 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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