| PART |
Description |
Maker |
| ED2-9T ED2-9TNJ ED2-9TNU ED2-4.5S ED2-4.5SNJ ED2-4 |
Ultra-low power, compact and lightweight, High breakdown voltage, Surface mounting type
|
NEC
|
| HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| KD2003-DG12A |
Compact high speed thick film thermal printhead (8dots / mm)
|
Rohm
|
| KD3004-DF10A |
Compact high speed thick film thermal printhead (12 dots / mm)
|
Rohm
|
| KF2002-GF41A |
Compact high speed thick film thermal printhead (8dots/ mm)
|
Rohm
|
| KF3003-GD31A |
Compact high speed thick film thermal printhead (12 dots / mm)
|
Rohm
|
| L1SS400CST5G |
High speed switching Extremely small surface mounting type.
|
Leshan Radio Company
|
| PT6721TR8 PT6721B PT67-21B PT6721C2 PT67-21C2 PT67 |
high speed silicon NPN epitaxial planar phototransistor in a compact surface-mountable package.
|
Everlight Electronic Co., Ltd.
EVERLIGHT[Everlight Electronics Co., Ltd]
http://
|
| UB2-3SNU-R UB2-3NUN-R UB2-3SNU UA2-3NJ UA2-3NJ-R U |
Super-compact size, Slim-package, Surface mounting type
Super-compact size/ Slim-package/ Surface mounting type
Super-compact size Slim-package Surface mounting type
|
NEC Corp.
NEC[NEC]
|
| SIL865170 |
AC Semiconductor Contactor pitch 22,5mm compact size and DIN rail mounting.
|
celduc-relais
|
| SIL842170 |
AC Semiconductor Contactor pitch 22,5mm compact size and DIN rail mounting.
|
celduc-relais
|
| SIL865970 |
AC Semiconductor Contactor pitch 22,5mm compact size and DIN rail mounting.
|
celduc-relais
|
