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| PD - 94352 IRGC49B120UB Die in Wafer Form Features * * * * * * * * * GEN5 Non Punch Through (NPT) Technology Low VCE(on) 10s Short Circuit Capability Square RBSOA Positive VCE(on) Temperature Coefficient Benchmark Efficiency above 20KHz Rugged Transient Performance Excellent Current Sharing in Parallel Operation Qualified for Industrial Market C Benefits G E 1200V IC(nom)= 50A VCE(on) typ.=3.39V @ IC(nom) @ 25C UltraFast IGBT Short Circuit Rated 150mm Wafer Reference Standard IR Package Part: IRGPS40B120UD Electrical Characteristics (Wafer Form) Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Guaranteed (min, max) Collector-to-Emitter Saturation Voltage 1.80V min, 2.25V max Colletor-to-Emitter Breakdown Voltage 1200V min Gate Threshold Voltage 4.4V min, 6.0V max Zero Gate Voltage Collector Current 20A max Gate-to-Emitter Leakage Current 1.1A max Test Conditions IC = 10A, TJ = 25C, VGE = 15V TJ = 25C, ICES = 500A, VGE = 0V VGE = VCE , TJ =25C, IC = 500A TJ = 25C, VCE = 1200V TJ = 25C, VGE = +/-20V Mechanical Data Nominal Backmetal Composition, (Thickness) Nominal Front Metal Composition, (Thickness) Dimensions Wafer Diameter Wafer Thickness, Tolerance Relevant Die Mechanical Dwg. Number Minimum Street Width Reject Ink Dot Size Ink Dot Location Recommended Storage Environment Recommended Die Attach Conditions Al - Ti - Ni/V - Ag, (1kA - 1kA - 4kA - 6kA) 99% Al/1% Si, (4m) 0.305" x 0.390" 150mm, with std. < 100 > flat 185m, +/-15m 01-5404 100m 0.25mm diameter minimum Consistent throughout same wafer lot Store in original container, in dessicated nitrogen, with no contamination For optimum electrical results, die attach temperature should not exceed 300C Die Outline 7.747 [.305] 6.354 [.250] NOT ES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMET ERS [INCHES ]. 2. CONTROLLING DIMENSION: [INCH]. 3. LET TER DES IGNATION: S = S OURCE G = GATE S K = S OURCE KELVIN IS = CURRENTSENSE < 0.635 TOLERANCE = + /- 0.013 < [.0250] T OLERANCE = + /- [.0005] > 0.635 TOLERANCE = + /- 0.025 > [.0250] T OLERANCE = + /- [.0010] < 1.270 TOLERANCE = + /- 0.102 < [.050] T OLERANCE = + /- [.004] > 1.270 TOLERANCE = + /- 0.203 > [.050] T OLERANCE = + /- [.008] E = EMIT TER 4. DIMENS IONAL T OLERANCES: EMIT TER 1.205 [.047] 8.429 [.332] 9.906 [.390] BONDING PADS : WIDTH & LENGT H OVERALL DIE: G 1.196 [.047] WIDTH & LENGT H www.irf.com 01/07/02 |
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