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0.38mm Datasheet PDF File

For 0.38mm Found Datasheets File :: 668 Search Time::1.703ms
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				ETC[ETC]
Part No.	BS29SS
OCR Text	...Row W H S WIDTH HEIGHT STANDOFF 0.100" / 2,54mm 0.200" / 5,08mm 0.015" / 0,38mm Dual Row 0.200" / 5,08mm 0.200" / 5,08mm 0.015" / 0,38mm Single Row 0.120" / 3,05mm 0.335" / 8,51mm 0.015" / 0,38mm Dual Row 0.220" / 5,59mm 0.335" / 8,51mm 0.0...
Description	Board mount socket
File Size	41.21K / 3 Page	View it Online	Download Datasheet

				KEMET[Kemet Corporation] KEMET, Corp. Mini-Circuits
Part No.	CDR32BX129BDWR CDR01BP101ABSM CDR01BP101ABSP CDR01BP101ABSR CDR01BP101ABUM CDR01BP101ABUP CDR01BP101ABUR CDR01BP101ABWM CDR01BP101ABWP CDR01BP101ABWR CDR01BP101ACSM CDR01BP101ACSP CDR01BP101ACSR CDR01BP101ACUM CDR01BP101ACUP CDR01BP101ACUR CDR01BP101ACWM CDR01BP101ACWP CDR01BP101ACWR CDR01BP101ADSM CDR01BP101ADSP CDR01BP101ADSR CDR01BP101ADUM CDR01BP101ADUP CDR01BP101ADUR CDR01BP101ADWM CDR01BP101ADWP CDR01BP101ADWR CDR01BP101BBSM CDR01BP101BBSP CDR01BP101BBSR CDR01BP101BBUM CDR01BP101BBUP CDR01BP101BBUR CDR01BP101BBWM CDR01BP101BBWP CDR01BP101BBWR CDR01BP101BCSM CDR01BP101BCSP CDR01BP101BCSR CDR01BP101BCUM CDR01BP101BCUP CDR01BP101BCUR CDR01BP101BCWM CDR01BP101BCWP CDR01BP101BCWR CDR01BP101BDSM CDR01BP101BDSP CDR01BP101BDSR CDR01BP101BDUM CDR01BP101BDUP CDR01BP101BDUR CDR01BP101BDWM CDR01BP101BDWP CDR01BP101BDWR CDR01BP109ABSM CDR01BP109ABSP CDR01BP109ABSR CDR01BP109ABUM CDR01BP109ABUP CDR01BP109ABUR CDR01BP109ABWM CDR01BP109ABWP CDR01BP109ABWR CDR01BP109ACSM CDR01BP109ACSP CDR01BP109ACSR CDR01BP109ACUM CDR01BP109ACUP CDR01BP109ACUR CDR01BP109ACWM CDR01BP109ACWP CDR01BP109ACWR CDR01BP109ADSM CDR01BP109ADSP CDR01BP109ADSR CDR01BP109ADUM CDR01BP109ADUP CDR01BP109ADUR CDR01BP109ADWM
OCR Text	...1.50 (.059) 1.50 (.059) .51 0.25 (.020 .010) .51 0.25 (.020 .010) .51 0.25 (.020 .010) .51 0.25 (.020 .010) .51 0.25 (.020 .010) .51...38MM (.015) CDR02-06 0.64MM (.025) 0.38mm (.015) CDR31-35 0.60MM (.023) 0.30MM (.012) MIL-PRF-556...
Description	CERAMIC CHIP/MIL-PRF-55681 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.39 uF, SURFACE MOUNT, 1825 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.27 uF, SURFACE MOUNT, 1825 CHIP
File Size	959.72K / 10 Page	View it Online	Download Datasheet

				TOTAL-POWER[Total Power International]
Part No.	D60 D-60A D-60B
OCR Text	...C STANDARDS NOTE : CH1 5V 2% 4A 0.3-6A 75mVp-p 0.5% 0.5% 56W 73% CH1:+10,-5% 85~264VAC 47~63Hz; 120~370VDC 2A/115V 1A/230V COLD START 30A/11...38mm CASE:901 0.55Kgs UL1012, TUV EN60950, IEC950, UL1950 APPROVED CISPR22 (EN55022) CLASS B, IEC801...
Description	TOTAL POWER INT. D60 AC-DC 60W POWER SUPPLY WITH DUAL OUTPUT
File Size	26.62K / 1 Page	View it Online	Download Datasheet

				ASTEC[Astec America, Inc] Emerson Network Power
Part No.	DS1300-3
OCR Text	...A FCC Subpart J EN55022 Class A 0.99 typical 0.75mA @ 240VAC 12ms minimum +12v @ 74A (90VAC) or 106A (180VAC) +3.3vsb @ 7A Factory Set, no pot adjustments +12vdc; 3%; +3.3vsb; 3% +12vdc; 110 - 130% latches off if overcurrent lasts over 1.5 ...
Description	AC-DC / Distributed Power Front-End 2U 1300 Watts 12V Distributed Power System
File Size	270.97K / 4 Page	View it Online	Download Datasheet

				Emerson Network Power ASTEC[Astec America, Inc]
Part No.	DS1500-3
OCR Text	...A FCC Subpart J EN55022 Class A 0.99 typical 0.75mA @ 240VAC 12ms minimum +12v @ 74A (90VAC) or 123A (180VAC) +3.3vsb @ 7A Factory Set, no pot adjustments +12vdc; 3%; +3.3vsb; 3% +12vdc; 110 - 130% latches off if overcurrent lasts over 1.5 ...
Description	1500 Watts 12V Distributed Power System AC-DC / Distributed Power Front-End 2U
File Size	271.04K / 4 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	GLBCSC08 GBLCSC03 GBLCSC03_07 GBLCSC03C GBLCSC05 GBLCSC05C GBLCSC08C GBLCSC0307
OCR Text	05246 GBLCSC03 thru GBLCSC08C ULTRA LOW CAPACITANCE TVS ARRAY APPLICATIONS Ethernet - 10/100/1000 Base T Cellular Phones Handhe...38mm) Outline & Dimensions: Rev 2 - 9/05, 06037 Tape & Reel Specifications (Dimensions in mill...
Description	ULTRA LOW CAPACITANCE TVS ARRAY
File Size	54.10K / 3 Page	View it Online	Download Datasheet

				Integrated Circuit Syst... ICST[Integrated Circuit Systems]
Part No.	ICS83905AMT ICS83905 ICS83905AG ICS83905AGT ICS83905AK ICS83905AKT ICS83905AM ICS83905AMLF ICS83905AMLFT
OCR Text	... 16-Lead TSSOP 4.4mm x 3.0mm x 0.92mm body package G Pacakge Top View XTAL_OUT ENABLE2 ENABLE1 XTAL_IN ENABLE 2 SYNCHRONIZE GND GND BCLK0 VDDO BCLK1 1 2 3 20 19 18 17 16 ICS83905 15 nc BCLK5 VDDO BCLK4 GND GND 20-L...
Description	LOW SKEW, 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER LOW SKEW/ 1:6 CRYSTAL INTERFACE-TOLVCMOS / LVTTL FANOUT BUFFER
File Size	352.26K / 14 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors]
Part No.	LC171W03-A4
OCR Text	...G. Philips LCD Co., Ltd Ver. 0.0 Jan.10, 2002 1 / 28 LC171W03 Liquid Crystal Display Product Specification Contents No C...38mm) diagonal 400.0(H) x 258.0(V) x 22.0(D) mm(Typ.) 0.291mm x 0.291mm 1280 horiz. By 768 vert. Pix...
Description	SPECIFICATION FOR APPROVAL
File Size	727.78K / 28 Page	View it Online	Download Datasheet

				Filtronic Compound Semi... FILTRONIC[Filtronic Compound Semiconductors]
Part No.	LMA183
OCR Text	...ocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. Ultrasonic bonding is not recommended. 2.) The recommen...
Description	2-18 GHz MESFET Amplifier
File Size	63.58K / 3 Page	View it Online	Download Datasheet

				Filtronic Compound Semi... FILTRONIC[Filtronic Compound Semiconductors]
Part No.	LMA184
OCR Text	...ocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. Ultrasonic bonding is not recommended. 2.) The recommen...
Description	2-18 GHz MESFET Amplifier
File Size	67.13K / 3 Page	View it Online	Download Datasheet

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