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  15015-0423 Datasheet PDF File

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    33482-0402 33482-0403 33482-0408 33482-0417 33482-0419 33482-0422 33482-0401 33482-0407 33482-0416 33482-0404 33482-0406

Molex Electronics Ltd.
Part No. 33482-0402 33482-0403 33482-0408 33482-0417 33482-0419 33482-0422 33482-0401 33482-0407 33482-0416 33482-0404 33482-0406 33482-0409 33482-0423 33482-0413 33482-0411 33482-0412 33482-0414 33482-0418 33482-0421 33482-0424 33482-0425
Description MX150 2X2 BLADE SEALED ASSEMBLY MAT SEAL
File Size 452.18K  /  5 Page

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Amphenol Communications Solutions
Part No. 10085901-5015EHLF
Description 0.50mm Flex Connector, VHC Series, 50 Position, Bottom Side Contact, Side Entry Surface Mount ZIF Connector, Halogen Free, Lead Free Type.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    ATS015015009-SF-4H

Advanced Thermal Solutions, Inc.
Part No. ATS015015009-SF-4H
Description 15.00 x 15.00 x 9.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin
File Size 278.10K  /  1 Page

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Amphenol Communications Solutions
Part No. 54122-111501500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 50 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    ATS015015006-MF-4E

Advanced Thermal Solutions, Inc.
Part No. ATS015015006-MF-4E
Description 15.00 x 15.00 x 6.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin
File Size 279.82K  /  1 Page

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Amphenol Communications Solutions
Part No. MUSB2K15015BP
Description Rugged USB Micro AB Interface Accessory, Input Output Connector, Dust Cover, Black color.
Tech specs 　 　

Official Product Page

    ATS015015002-MF-4A

Advanced Thermal Solutions, Inc.
Part No. ATS015015002-MF-4A
Description 15.00 x 15.00 x 2.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin
File Size 279.86K  /  1 Page

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Amphenol Communications Solutions
Part No. 68604-232HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 32 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    ATS015015003-MF-4B

Advanced Thermal Solutions, Inc.
Part No. ATS015015003-MF-4B
Description 15.00 x 15.00 x 3.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin
File Size 279.93K  /  1 Page

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Amphenol Communications Solutions
Part No. 69190-423HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 23 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    ATS015015008-SF-4G

Advanced Thermal Solutions, Inc.
Part No. ATS015015008-SF-4G
Description 15.00 x 15.00 x 8.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin
File Size 278.11K  /  1 Page

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Amphenol Communications Solutions
Part No. 78290-423HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 23 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs 　 　

Official Product Page

    ATS015015020-SF-4S

Advanced Thermal Solutions, Inc.
Part No. ATS015015020-SF-4S
Description 15.00 x 15.00 x 20.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin
File Size 277.93K  /  1 Page

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Amphenol Communications Solutions
Part No. 68004-230HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs 　 　

Official Product Page

    ATS015015022-MF-4U

Advanced Thermal Solutions, Inc.
Part No. ATS015015022-MF-4U
Description 15.00 x 15.00 x 22.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin
File Size 279.95K  /  1 Page

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Amphenol Communications Solutions
Part No. 68004-235HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs 　 　

Official Product Page

    ATS015015005-MF-4D

Advanced Thermal Solutions, Inc.
Part No. ATS015015005-MF-4D
Description 15.00 x 15.00 x 5.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin
File Size 279.93K  /  1 Page

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Amphenol Communications Solutions
Part No. 68604-231HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 31 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    ATS015015009-MF-4H

Advanced Thermal Solutions, Inc.
Part No. ATS015015009-MF-4H
Description 15.00 x 15.00 x 9.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin
File Size 279.83K  /  1 Page

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Amphenol Communications Solutions
Part No. 68004-231HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 2.72 mm (0.107in) Tail.
Tech specs 　 　

Official Product Page

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