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  70287-1011 Datasheet PDF File

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Part No. 0702871043
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 90 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 308.20K  /  6 Page

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Rochester Electronics LLC

Part No. BLA1011-300
Description BLA1011-300 - 300W LDMOS Avionics Power Transistor
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0702871236

Molex Electronics Ltd.
Part No. 0702871236
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 84 Circuits, 6.10mm (.240") Mating Pin Length, 0.76渭m (30渭") Gold (Au) Se

File Size 308.23K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    70287-1000 0702871000

Molex Electronics Ltd.
Part No. 70287-1000 0702871000
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 4 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 4 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 308.31K  /  6 Page

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Amphenol Communications Solutions

Part No. 10118085-101-10LF
Description Unshrouded Right Angle Header, Surface Mount With Peg, Double row , 10 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    70287-1002 0702871002

Molex Electronics Ltd.
Part No. 70287-1002 0702871002
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 8 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 8 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 308.32K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114831-10112LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 12 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    0702871093

Molex Electronics Ltd.
Part No. 0702871093
Description 2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 92 Circuits

File Size 303.29K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114829-10113LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 13 Positions
Tech specs    

Official Product Page

    70287-1004 0702871004

Molex Electronics Ltd.
Part No. 70287-1004 0702871004
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 12 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 12 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 308.31K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114828-10113LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 13 Positions
Tech specs    

Official Product Page

    70287-1005 0702871005

Molex Electronics Ltd.
Part No. 70287-1005 0702871005
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with Retention Pin, 14 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 14 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 308.31K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114830-10113LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 13 Positions
Tech specs    

Official Product Page

    70287-1006 0702871006

Molex Electronics Ltd.
Part No. 70287-1006 0702871006
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 16 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 16 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 308.31K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114831-10111LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 11 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    70287-1007 0702871007

Molex Electronics Ltd.
Part No. 70287-1007 0702871007
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with Retention Pin, 18 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 18 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 308.31K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114830-10112LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 12 Positions
Tech specs    

Official Product Page

    70287-1008 0702871008

Molex Electronics Ltd.
Part No. 70287-1008 0702871008
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 20 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 20 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 308.31K  /  6 Page

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Amphenol Communications Solutions

Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 70287-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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