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  75757-5161 Datasheet PDF File

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    75757-0322 0757570322

Molex Electronics Ltd.
Part No. 75757-0322 0757570322
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 98.95K  /  3 Page

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Amphenol Communications Solutions

Part No. 51617-XX002LF
Description PwrBlade®, Power Supply Connectors, 5P 24S 1M 7P PF Vertical Receptacle.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    75757-1461 0757571461

Molex Electronics Ltd.
Part No. 75757-1461 0757571461
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 84516-102
Description 200 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    75757-1462 0757571462

Molex Electronics Ltd.
Part No. 75757-1462 0757571462
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length

File Size 166.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-3516-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-1442 0757571442

Molex Electronics Ltd.
Part No. 75757-1442 0757571442
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 1.5um (60u) Tin (Sn) Plating

File Size 166.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8516-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-0422 0757570422

Molex Electronics Ltd.
Part No. 75757-0422 0757570422
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25um (50u) Nickel (Ni) Overall

File Size 98.91K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-7516-11H
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    75757-0421 0757570421

Molex Electronics Ltd.
Part No. 75757-0421 0757570421
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall

File Size 98.91K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-516122300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75757-1401 0757571401

Molex Electronics Ltd.
Part No. 75757-1401 0757571401
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.40K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-7516-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-0342 0757570342

Molex Electronics Ltd.
Part No. 75757-0342 0757570342
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25um (50u) Nickel (Ni) Overall

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6516-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    75757-0351 0757570351

Molex Electronics Ltd.
Part No. 75757-0351 0757570351
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits

File Size 99.22K  /  3 Page

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Amphenol Communications Solutions

Part No. F516-1A7H1-21014
Description Flex Connector, 1.00mm Pitch, Height 2.00mm, Right angle, Flip type, ZIF, 14 position, With MYLAR
Tech specs    

Official Product Page

    75757-0332 0757570332

Molex Electronics Ltd.
Part No. 75757-0332 0757570332
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 10137925-1612LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 16 Positions, Non GW Compatible LCP, Tape and Reel. .
Tech specs    

Official Product Page

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