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  CCM04-1814 Datasheet PDF File

For CCM04-1814 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    0918143140 91814-3140 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143140 91814-3140 SD-91814-001
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 40 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 40 Circuits, Tin (Sn) over Nickel (Ni)

File Size 124.03K  /  3 Page

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Amphenol Communications Solutions

Part No. 10131318-14211G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Bright Tin plating, Natural Color, 14 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    91814-3106 SD-91814-001 0918143106

Molex Electronics Ltd.
Part No. 91814-3106 SD-91814-001 0918143106
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 6 Circuits, Tin (Sn) over Nickel (Ni)

File Size 123.85K  /  3 Page

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Amphenol Communications Solutions

Part No. 77313-818-14LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 14 Positions
Tech specs    

Official Product Page

    0918141210 SD-91814-002 91814-1210

Molex Electronics Ltd.
Part No. 0918141210 SD-91814-002 91814-1210
Description 2.54mm (.100) Pitch C-Grid III Dual Row Vertical Shrouded Header, 10 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100") Pitch C-Grid III Dual Row Vertical Shrouded Header, 10 Circuits, Tin (Sn) over Nickel (Ni)

File Size 161.30K  /  4 Page

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Amphenol Communications Solutions

Part No. 61083-181422LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 180 Positions.
Tech specs    

Official Product Page

    0918143130 91814-3130 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143130 91814-3130 SD-91814-001
Description 2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 30 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 30 Circuits, Tin (Sn) over Nickel (Ni)

File Size 123.85K  /  3 Page

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Amphenol Communications Solutions

Part No. 77315-818-14LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0918143132 91814-3132 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143132 91814-3132 SD-91814-001
Description 2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 32 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 32 Circuits, Tin (Sn) over Nickel (Ni)

File Size 123.85K  /  3 Page

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Amphenol Communications Solutions

Part No. 61082-181422LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 180 Positions.
Tech specs    

Official Product Page

    0918143138 91814-3138 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143138 91814-3138 SD-91814-001
Description 2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 38 Circuits, Tin (Sn)
2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 38 Circuits, Tin (Sn)

File Size 123.85K  /  3 Page

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Amphenol Communications Solutions

Part No. 10131318-14111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 14 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    91814-3108 SD-91814-001 0918143108

Molex Electronics Ltd.
Part No. 91814-3108 SD-91814-001 0918143108
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 8 Circuits, Tin

File Size 123.85K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-814051950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0918143114 91814-3114 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143114 91814-3114 SD-91814-001
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 14 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 14 Circuits, Tin (Sn) over Nickel (Ni)

File Size 124.03K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-181409LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 180 Positions.
Tech specs    

Official Product Page

    0918143112 91814-3112 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143112 91814-3112 SD-91814-001
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 12 Circuits, Tin (Sn)
2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 12 Circuits, Tin (Sn)

File Size 124.03K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-409181450LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 18 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0918143110 91814-3110 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143110 91814-3110 SD-91814-001
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 10 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 10 Circuits, Tin (Sn) over Nickel (Ni)

File Size 124.03K  /  3 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61083-181402LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 180 Positions.
Tech specs    

Official Product Page

For CCM04-1814 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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