CGA-6618 pdf Datasheet P10 Part Num --- IC-ON-LINE


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CGA-6618 Datasheet PDF File

For CGA-6618 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |

					TDK Electronics
Part No.	CGA2B2C0G1H2R2C050BD
Description	Automotive Grade ( Counductive Epoxy Application )
File Size	122.74K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-21H
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					TDK Electronics
Part No.	CGA2B2NP01H050C050BA
Description	Automotive Grade ( High Temperature Application )
File Size	122.67K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-21D
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA3E2C0G2A080D080AD
Description	Multilayer Ceramic Chip Capacitors
File Size	122.45K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-0200LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 2 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA3E2NP02A080D080AA
Description	Automotive Grade ( High Temperature Application )
File Size	122.55K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-1200LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 12 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA8M1C0G3F221K200KA
Description	Automotive Grade ( High Voltage (1000V and over) )
File Size	122.87K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-1100LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 11 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA4J1X7R0J106K125AC
Description	Automotive Grade ( General (Up to 50V) )
File Size	130.73K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-0400LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 4 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA4J1X7R0J685M125AC-17
Description	Multilayer Ceramic Chip Capacitors
File Size	232.53K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-1400LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 14 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA4J1X7R0J106K125AC-17
Description	Multilayer Ceramic Chip Capacitors
File Size	232.37K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	DWRT200PM16618
Description	COOLPOWER MEZZANINE
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA2B3X7R1H473M050BD
Description	Multilayer Ceramic Chip Capacitors
File Size	130.88K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-11H
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA4J3X7R1C475M125AB-17
Description	Multilayer Ceramic Chip Capacitors
File Size	230.24K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-11D
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

For CGA-6618 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |

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