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  chipscale Datasheet PDF File

For chipscale Found Datasheets File :: 155    Search Time::4.938ms    
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    Power Innovations
Part No. 2FAH-C20R
OCR Text ...100 6.5V OUT7 Thinfilm Model chipscale No. of Solder Bumps Packaging Option - R = Tape and Reel Packaged 3000 pcs. / 7 " reel GROUND GROUND Fig. 4 - Device Block Diagram Specifications are subject to change without notice. Cu...
Description ISOlated Resistor With Esd Protection

File Size 81.67K  /  4 Page

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    Bourns, Inc.
Part No. 2FAK-C15R
OCR Text ... 2 FAK - C15R__ Thinfilm Model chipscale EXT2 R1: 100 ohms INT2 No. of Solder Bumps Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel EXT3 R2: 100 ohms INT3 GND EXT4 R3: 100 ohms INT4 EXT5 R4...
Description Interface, ESD protection and EMI filtering for the data port of portable electronic devices such as cell phones, modems and PDAs, Tape and Reel

File Size 217.71K  /  4 Page

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    Bourns, Inc.
Part No. 2FAM-C5R
OCR Text ... 2 FAM - C5R__ Thinfilm Model chipscale No. of Solder Bumps Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel EXT2 INT2 R2: 10 OHMS Specifications are subject to change without notice. Customers should verify ac...
Description Interface, ESD protection and EMI filtering for the data port of portable electronic devices such as cell phones, modems and PDAs, Tape and Reel

File Size 234.58K  /  4 Page

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    Vishay Intertechnology
Part No. SI8435DB
OCR Text ...FET * Ultra Small MICRO FOOT(R) chipscale Packaging Reduces Footprint Area, Profile COMPLIANT (0.62 mm) and On-Resistance Per Footprint Area RoHS APPLICATIONS * Low Threshold Load Switch for Portable Devices - Low Power Consumption ...
Description P-Channel 20-V (D-S) MOSFET

File Size 140.52K  /  8 Page

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    MASW-004103-1365V4

M/A-COM Technology Solutions, Inc.
Part No. MASW-004103-1365V4
OCR Text ...to 20 ghz. this surface mount chipscale configuration is optimized for broadband performance with minimal associated parasitics usually associated with hybrid mic designs incorporating beam lead and pin diodes that require chip and w...
Description HMICTM Silicon PIN Diode SP4T Switch

File Size 332.22K  /  8 Page

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    Taiwan Semiconductor Co., Ltd.
Part No. TS4405P
OCR Text ...al mosfet process technology in chipscale bondwireless packaging minimizes pcb space and r ds(on) plus provides an ultra- low qg x r ds(on) figure of merit. absolute maximum ratings t a =25c unless otherwise noted symbo...
Description Single P-Channel 1.8V Specified MicroSURF

File Size 141.67K  /  3 Page

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    Taiwan Semiconductor Co., Ltd.
Part No. TS8314
OCR Text ...al mosfet process technology in chipscale bondwireless packaging minimizes pcb space and r ds(on) plus provides an ultra- low qg x r ds(on) figure of merit. absolute maximum ratings t a =25c unless otherwise noted symbo...
Description Bi-directional N-Channel 2.5V Specified MicroSURF

File Size 1,834.43K  /  28 Page

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    Taiwan Semiconductor Co., Ltd.
Part No. TS8405P
OCR Text ...al mosfet process technology in chipscale bondwireless packaging minimizes pcb space and r ds(on) plus provides an ultra- low qg x r ds(on) figure of merit. absolute maximum ratings t a =25c unless otherwise noted symbo...
Description Single P-Channel 1.8V Specified MicroSURF

File Size 385.02K  /  12 Page

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For chipscale Found Datasheets File :: 155    Search Time::4.938ms    
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