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Power Innovations
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Part No. |
2FAH-C20R
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OCR Text |
...100 6.5V OUT7
Thinfilm Model chipscale No. of Solder Bumps Packaging Option - R = Tape and Reel Packaged 3000 pcs. / 7 " reel
GROUND
GROUND
Fig. 4 - Device Block Diagram
Specifications are subject to change without notice. Cu... |
Description |
ISOlated Resistor With Esd Protection
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File Size |
81.67K /
4 Page |
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Bourns, Inc.
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Part No. |
2FAK-C15R
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OCR Text |
...
2 FAK - C15R__
Thinfilm Model chipscale
EXT2 R1: 100 ohms
INT2
No. of Solder Bumps Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel
EXT3
R2: 100 ohms
INT3
GND
EXT4 R3: 100 ohms
INT4
EXT5
R4... |
Description |
Interface, ESD protection and EMI filtering for the data port of portable electronic devices such as cell phones, modems and PDAs, Tape and Reel
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File Size |
217.71K /
4 Page |
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it Online |
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Bourns, Inc.
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Part No. |
2FAM-C5R
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OCR Text |
...
2 FAM - C5R__
Thinfilm Model chipscale No. of Solder Bumps Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel
EXT2
INT2
R2: 10 OHMS
Specifications are subject to change without notice. Customers should verify ac... |
Description |
Interface, ESD protection and EMI filtering for the data port of portable electronic devices such as cell phones, modems and PDAs, Tape and Reel
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File Size |
234.58K /
4 Page |
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it Online |
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Vishay Intertechnology
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Part No. |
SI8435DB
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OCR Text |
...FET * Ultra Small MICRO FOOT(R) chipscale
Packaging Reduces Footprint Area, Profile COMPLIANT (0.62 mm) and On-Resistance Per Footprint Area
RoHS
APPLICATIONS * Low Threshold Load Switch for Portable Devices
- Low Power Consumption ... |
Description |
P-Channel 20-V (D-S) MOSFET
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File Size |
140.52K /
8 Page |
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it Online |
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Taiwan Semiconductor Co., Ltd.
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Part No. |
TS4405P
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OCR Text |
...al mosfet process technology in chipscale bondwireless packaging minimizes pcb space and r ds(on) plus provides an ultra- low qg x r ds(on) figure of merit. absolute maximum ratings t a =25c unless otherwise noted symbo... |
Description |
Single P-Channel 1.8V Specified MicroSURF
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File Size |
141.67K /
3 Page |
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it Online |
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Taiwan Semiconductor Co., Ltd.
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Part No. |
TS8314
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OCR Text |
...al mosfet process technology in chipscale bondwireless packaging minimizes pcb space and r ds(on) plus provides an ultra- low qg x r ds(on) figure of merit. absolute maximum ratings t a =25c unless otherwise noted symbo... |
Description |
Bi-directional N-Channel 2.5V Specified MicroSURF
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File Size |
1,834.43K /
28 Page |
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it Online |
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Taiwan Semiconductor Co., Ltd.
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Part No. |
TS8405P
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OCR Text |
...al mosfet process technology in chipscale bondwireless packaging minimizes pcb space and r ds(on) plus provides an ultra- low qg x r ds(on) figure of merit. absolute maximum ratings t a =25c unless otherwise noted symbo... |
Description |
Single P-Channel 1.8V Specified MicroSURF
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File Size |
385.02K /
12 Page |
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it Online |
Download Datasheet
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Price and Availability
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