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  HEDT-9140 Datasheet PDF File

For HEDT-9140 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    SPS-9140MG08 SPS-9140AMG

Optoway Technology Inc
Part No. SPS-9140MG08 SPS-9140AMG
Description 3.3V / 1310 nm / Multirate SFP LC SINGLE-MODE TRANSCEIVER

File Size 145.35K  /  5 Page

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Amphenol Communications Solutions

Part No. 10129382-914003BLF
Description EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Header, Double Row, Right-Angle, Through Hole, 14 Positions, 2.54mm Pitch, 8.08mm (0.318inch) Mating, 3.05mm (0.12inch) Tail
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    WE9140 WE9140A WE9140B WE9140G WE9140J WE9140U

Winbond Electronics
WINBOND[Winbond]
Part No. WE9140 WE9140A WE9140B WE9140G WE9140J WE9140U
Description TONE/PULSE SWITCHABLE DIALER WITH REDIAL

File Size 712.08K  /  18 Page

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Amphenol Communications Solutions

Part No. 88914-016LF
Description Metral® Accessories, Backplane Connectors, Board-to-Board Keying System Keying Pin, LF.
Tech specs    

Official Product Page

    0879140616 87914-0616

Molex Electronics Ltd.
Part No. 0879140616 87914-0616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 6 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions

Part No. 69191-405HLF
Description BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Single Row, 5 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    44914-0201 0449140201

Molex Electronics Ltd.
Part No. 44914-0201 0449140201
Description 3.00mm (.118) Pitch Micro-Fit 3.0 CPI Header, Compliant Pin Interface, Dual Row,Vertical, 2 Circuits, Tin (Sn) Plating, Glow Wire Compatible

File Size 172.89K  /  3 Page

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Amphenol Communications Solutions

Part No. 89891-408LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    44914-0202 0449140202

Molex Electronics Ltd.
Part No. 44914-0202 0449140202
Description 3.00mm (.118) Pitch Micro-Fit 3.0 CPI Header, Dual Row, Vertical, Compliant Pin Interface, 2 Circuits, LCP, Glass-Filled, UL 94V-0, 0.38μm (15μ) Gold (Au) Selective Contact Plating

File Size 169.89K  /  3 Page

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Amphenol Communications Solutions

Part No. 68691-408H
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    44914-0402 0449140402

Molex Electronics Ltd.
Part No. 44914-0402 0449140402
Description 3.00mm (.118") Pitch Micro-Fit 3.0 CPI Header, Dual Row, Vertical, Compliant Pin Interface, 4 Circuits, LCP
3.00mm (.118) Pitch Micro-Fit 3.0 CPI Header, Dual Row, Vertical, Compliant Pin Interface, 4 Circuits, LCP

File Size 169.88K  /  3 Page

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Amphenol Communications Solutions

Part No. 89891-403H
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    44914-0403 0449140403

Molex Electronics Ltd.
Part No. 44914-0403 0449140403
Description 3.00mm (.118") Pitch Micro-Fit 3.0 CPI Header, Dual Row, Vertical, Compliant Pin Interface, 4 Circuits, LCP
3.00mm (.118) Pitch Micro-Fit 3.0 CPI Header, Dual Row, Vertical, Compliant Pin Interface, 4 Circuits, LCP

File Size 169.88K  /  3 Page

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Amphenol Communications Solutions

Part No. 10129382-914004BLF
Description EconoStik™ 2.54mm, Board to Board Connector, Unshrouded Header, Double Row, Right-Angle, Through Hole, 14 Positions, 2.54mm Pitch, 8.08mm (0.318inch) Mating, 2.29mm (0.09inch) Tail
Tech specs    

Official Product Page

    44914-0601 0449140601

Molex Electronics Ltd.
Part No. 44914-0601 0449140601
Description 3.00mm (.118") Pitch Micro-Fit 3.0 CPI Header, Compliant Pin Interface, Dual Row, Vertical, 6 Circuits
3.00mm (.118) Pitch Micro-Fit 3.0 CPI Header, Compliant Pin Interface, Dual Row, Vertical, 6 Circuits

File Size 172.89K  /  3 Page

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Amphenol Communications Solutions

Part No. 10129383-914002ALF
Description EconoStik™, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    44914-0602 0449140602

Molex Electronics Ltd.
Part No. 44914-0602 0449140602
Description 3.00mm (.118) Pitch Micro-Fit 3.0 CPI?/a> Header, Dual Row, Vertical, Compliant Pin Interface, 6 Circuits, LCP, Glass-Filled, UL 94V-0, 0.38μm (15μ) Gold (Au) Selective Contact Plating
3.00mm (.118) Pitch Micro-Fit 3.0 CPI Header, Dual Row, Vertical, Compliant Pin Interface, 6 Circuits, LCP, Glass-Filled, UL 94V-0, 0.38μm (15μ) Gold (Au) Selective Contact Plating

File Size 169.88K  /  3 Page

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Amphenol Communications Solutions

Part No. 68491-402HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 2 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    44914-0801 0449140801

Molex Electronics Ltd.
Part No. 44914-0801 0449140801
Description 3.00mm (.118") Pitch Micro-Fit 3.0 CPI Header, Compliant Pin Interface, Dual Row, Vertical, 8 Circuits, Tin
3.00mm (.118) Pitch Micro-Fit 3.0 CPI Header, Compliant Pin Interface, Dual Row, Vertical, 8 Circuits, Tin

File Size 172.89K  /  3 Page

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Amphenol Communications Solutions

Part No. 68691-406HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For HEDT-9140 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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