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  HG-0713 Datasheet PDF File

For HG-0713 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    0713491086

Molex Electronics Ltd.
Part No. 0713491086
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 421.50K  /  5 Page

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Amphenol Communications Solutions

Part No. 89007-136LF
Description Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0850400713 85040-0713

Molex Electronics Ltd.
Part No. 0850400713 85040-0713
Description 2.54mm (.100) Pitch DIN 41612 Receptacle, Style B/2, 32 Circuits, Lead free
MOLEX Connector

File Size 90.57K  /  4 Page

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Amphenol Communications Solutions

Part No. 77315-107-13LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0713086418 71308-6418

Molex Electronics Ltd.
Part No. 0713086418 71308-6418
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 18 Circuits, 1.50μm (59u) Minimum

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z1054071321
Description QSFP STACKED COMBO NO LP
Tech specs    

Official Product Page

    0713086440 71308-6440

Molex Electronics Ltd.
Part No. 0713086440 71308-6440
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 40 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 78207-130
Description PV®Wire-to-Board Connector System, 2 Wall Shrouded Right angled Header - Through Hole - Double row - 30 Positions, 2.54mm (0.100in) pitch.
Tech specs    

Official Product Page

    0713086442 71308-6442

Molex Electronics Ltd.
Part No. 0713086442 71308-6442
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 42 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z2054071341
Description QSFP 2X2 COMBO SP FG NO LP
Tech specs    

Official Product Page

    0713085424

Molex Electronics Ltd.
Part No. 0713085424
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 24 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 77315-407-13LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0713085422

Molex Electronics Ltd.
Part No. 0713085422
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 22 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 98426-S04-07-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0713085420 71308-5420

Molex Electronics Ltd.
Part No. 0713085420 71308-5420
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 20 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 20 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z2054071301
Description QSFP 2X2 COMBO SP FG NO LP
Tech specs    

Official Product Page

    0713085418 71308-5418

Molex Electronics Ltd.
Part No. 0713085418 71308-5418
Description 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 18 Circuits
2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 18 Circuits

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 98426-G04-07-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0713085416 71308-5416

Molex Electronics Ltd.
Part No. 0713085416 71308-5416
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 16 Circuits,1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 16 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.55K  /  8 Page

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Amphenol Communications Solutions

Part No. 66207-136LF
Description Quickie® IDC Cable-to-Board Connector System, Eject Latch Header, Vertical, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For HG-0713 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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