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MITSUMI[Mitsumi Electronics, Corp.]
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Part No. |
H52N-008-210-AGGE H32N-008-210-AGGE CIM-H32N CIM-H52R
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OCR Text |
...: 8pins) Housing material (21 : lcp resin) Housing UL grade (0 : UL94V-0) Contact plating (A : Gold) Contact plating thickness (G : 3m) Contact read style (G : Angle SMT) Package (E : Taping)
H52N-008-21 0 - A G G E
1 1 2 3 4 5 6 7 8 2 ... |
Description |
microSD card connectors
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File Size |
246.47K /
4 Page |
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ITT[ITT Industries]
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Part No. |
120220-0113
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OCR Text |
...ADS
Brass, Gold Plated Black lcp Black lcp Beryllium Copper, leg inserted with Brass Pin, Gold Plated
18.00 0.10
0.20
A 10.00
A
Swelling at bottom of shell to 8.20 MAX over 10.6 length
Section A - A
15.620.10
10 0 0... |
Description |
MOBILE CONNECTOR SERIES
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File Size |
181.88K /
1 Page |
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ERNI Electronics
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Part No. |
100101710001
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OCR Text |
...l contact area notes: material: lcp gf 30 schwarz material: lcp gf 30 black galvanik: min. 1,27 m unternickelung ber gesamten pin - bereich min. 0,127 m au im steckbereich gold - flash im ... |
Description |
Abgew. PCI Express STV 36pol.
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File Size |
55.04K /
1 Page |
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it Online |
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JAPAN AVIATION ELECTRONICS INDUSTRY LTD
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Part No. |
MX39004UQ1
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OCR Text |
...g socket housing pbt or 35%gf lcp sleeve, gnd shell brass or copper alloy / sn plating pin connector socket connector component material / finish pin contact brass / contact area: au plating terminal area: sn plating pin housi... |
Description |
4 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, SOLDER
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File Size |
206.96K /
6 Page |
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it Online |
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Price and Availability
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