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peeling Datasheet PDF File

For peeling Found Datasheets File :: 494 Search Time::1.125ms
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				Fuji Electric
Part No.	2MBI800UG-170
OCR Text	...al Visual inspection inspection peeling Plating and the others USLx1.2 Broken insulation The visual sample LSL : Lower specified limit. USL : Upper specified limit. Note : Each parameter measurement read-outs shall be made after stabi...
Description	IGBT MODULE
File Size	461.34K / 13 Page	View it Online	Download Datasheet

				Murata Electronics
Part No.	GRM40C0G100D050AB
OCR Text	...lbs. No evidence of termination peeling 1 mm deflection (Glass epoxy board) No mechanical damage Cap., DF, IR meet initial limits Meets Requirement For specific details contact factory Glass epoxy board 10 Deflection Solderabili...
Description	(GRMxx Series) Monolithic Ceramic Capacitors
File Size	171.03K / 4 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	TLWA1100T11 TLWA1100
OCR Text	.... Repeated baking may cause the peeling strength of the tape to change, leading to trouble in mounting. Also, be sure to prevent damage to the device from static electricity during the baking process. 5. Any breakage in the laminate packing...
Description	Panel Circuit Indicator
File Size	265.52K / 8 Page	View it Online	Download Datasheet

				http:// Toshiba Semiconductor
Part No.	TLWD1100T11 TLWD1100
OCR Text	.... Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. If the packing material of l...
Description	Panel Circuit Indicator
File Size	271.97K / 9 Page	View it Online	Download Datasheet

				Toshiba Corporation Toshiba Semiconductor
Part No.	TLWH1100T11 TLWH1100
OCR Text	.... Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. If the packing material of l...
Description	Zener Diode; Application: General; Pd (mW): 200; Vz (V): 12.91 to 13.49; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): ESD (kV) min: -; Package: MPAK Zener Diode; Application: General; Pd (mW): 200; Vz (V): 12.47 to 13.03; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): ESD (kV) min: -; Package: MPAK Panel Circuit Indicator
File Size	269.62K / 8 Page	View it Online	Download Datasheet

				Toshiba Corporation Toshiba Semiconductor
Part No.	TLWJ1100T11 TLWJ1100
OCR Text	.... Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. If the packing material of l...
Description	Zener Diode; Application: General; Pd (mW): 200; Vz (V): 13.84 to 15.52; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): ESD (kV) min: -; Package: MPAK Zener Diode; Application: General; Pd (mW): 200; Vz (V): 13.37 to 13.96; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): ESD (kV) min: -; Package: MPAK Panel Circuit Indicator
File Size	272.05K / 9 Page	View it Online	Download Datasheet

				Toshiba Corporation Toshiba Semiconductor
Part No.	TLWK1100BT11 TLWK1100B
OCR Text	.... Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. 5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not throw or drop the pack...
Description	Zener Diode; Application: General; Pd (mW): 200; Vz (V): 14.34 to 14.98; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): ESD (kV) min: -; Package: MPAK Zener Diode; Application: General; Pd (mW): 200; Vz (V): 13.84 to 14.46; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): ESD (kV) min: -; Package: MPAK Panel Circuit Indicator
File Size	253.25K / 9 Page	View it Online	Download Datasheet

				Fuji Electric
Part No.	1MBI300U4-120
OCR Text	...al Visual inspection inspection peeling Plating and the others USLx1.2 Broken insulation The visual sample LSL : Lower specified limit. USL : Upper specified limit. Note : Each parameter measurement read-outs shall be made after stabi...
Description	IGBT MODULE
File Size	416.16K / 13 Page	View it Online	Download Datasheet

				Fuji Electric
Part No.	1MBI400U4-120
OCR Text	...al Visual inspection inspection peeling Plating and the others USLx1.2 Broken insulation The visual sample LSL : Lower specified limit. USL : Upper specified limit. Note : Each parameter measurement read-outs shall be made after stabi...
Description	IGBT MODULE
File Size	432.02K / 13 Page	View it Online	Download Datasheet

For peeling Found Datasheets File :: 494 Search Time::1.125ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |