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Intel
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| Part No. |
80960CA-16 80960CA-33 80960CA-25
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| OCR Text |
...tem's highspeed external memory sub-system In addition the 80960CA's on-chip caching of instructions procedure context and critical program ...assembly and disassembly and a high performance fly-by mode capable of transfer speeds of up to 45 M... |
| Description |
32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR
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| File Size |
1,246.56K /
63 Page |
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INTEL[Intel Corporation]
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| Part No. |
80960CA-25 80960CA-16
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| OCR Text |
...tem's highspeed external memory sub-system In addition the 80960CA's on-chip caching of instructions procedure context and critical program ...assembly and disassembly and a high performance fly-by mode capable of transfer speeds of up to 45 M... |
| Description |
SPECIAL ENVIRONMENT 80960CA-25, -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR
SPECIAL ENVIRONMENT 80960CA-25 -16 32-BIT HIGH-PERFORMANCE EMBEDDED PROCESSOR
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| File Size |
1,239.89K /
62 Page |
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INTEL[Intel Corporation]
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| Part No. |
80960CF-16 80960CF-30 80960CF-25
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| OCR Text |
...tem's highspeed external memory sub-system In addition the 80960CF's on-chip caching of instructions procedure context and critical program ...assembly and disassembly and a high performance fly-by mode capable of transfer speed of up to 59 Mb... |
| Description |
SPECIAL ENVIRONMENT 80960CF-30, -25, -16 32-BIT HIGH-PERFORMANCE SUPERSCALAR PROCESSOR
SPECIAL ENVIRONMENT 80960CF-30 -25 -16 32-BIT HIGH-PERFORMANCE SUPERSCALAR PROCESSOR
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| File Size |
1,164.87K /
62 Page |
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Zarlink Semiconductor
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| Part No. |
CLA70000
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| OCR Text |
... cells Specialized DSP and BIST sub-libraries Compatible with Megacell and CLA60000
The CLA70000 product is manufactured near Plymouth, England in the latest purpose built facility for sub-micron process geometries. The factory uses the ... |
| Description |
High Density CMOS Gate Arrays
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| File Size |
189.15K /
17 Page |
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it Online |
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Yamaichi Electronics
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| Part No. |
DDP104
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| OCR Text |
Sub) Dual Port Solder Dip
Specifications
Insulation Resistance: Withstanding Voltage: Contact Resistance: Current Rating: Operating Temp. ...Assembly: 1 = Snap-in + 4-40 Clinch Nut (Standard) 2 = 4-40 Threaded
DP - 01 *
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1
Mater... |
| Description |
D Series Dual Port Solder Dip
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| File Size |
35.32K /
1 Page |
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC265LM3
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| OCR Text |
SUB-HARMONIC SMT MIXER, 20 - 31 GHz
Features
Integrated LO Amplifier: -4 dBm Input Sub-Harmonically Pumped (x2) LO High 2LO/RF Isolation: ...assembly processes. The LM3 package requires a specific mounting pattern to allow proper mechanical ... |
| Description |
GaAs MMIC SUB-HARMONIC SMT MIXER, 20 - 31 GHz
GaAs MMIC SUB-HARMONIC SMT MIXER 20 - 31 GHz
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| File Size |
292.86K /
8 Page |
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Zarlink Semiconductor
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| Part No. |
MT1020A
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| OCR Text |
...tooth Baseband Peripheral (BBP) sub system performs all time critical Bluetooth operations, with minimal processor overhead. It works as a slave peripheral device connected to the on-board Microprocessor. The block includes the Link Control... |
| Description |
Bluetooth Baseband Controller
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| File Size |
223.82K /
10 Page |
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it Online |
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