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8251EVM TC55V S9011 DS3140 74270017 SVM1060U ATMEGA6 SP2411
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  unlabeled Datasheet PDF File

For unlabeled Found Datasheets File :: 409    Search Time::2.312ms    
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    SIRENZA[SIRENZA MICRODEVICES]
Part No. SUF-2000
OCR Text .... 2. No connection required for unlabeled bond pads. 3. Die Thickness is 0.004 (0.100). 4. Typical bond pad is 0.004 (0.100) square. 5. Backside metalization: Gold. 6. Backside is Ground. 7. Bond pad metalization: Gold. Device Assembly ...
Description 0.2-10 GHz, Cascadable pHEMT MMIC Amplifier

File Size 148.34K  /  4 Page

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    SIRENZA[SIRENZA MICRODEVICES]
Part No. SUF-3000
OCR Text .... 2. No connection required for unlabeled bond pads. 3. Die Thickness is 0.004 (0.100). 4. Typical bond pad is 0.004 (0.100) square. 5. Backside metalization: Gold. 6. Backside is Ground. 7. Bond pad metalization: Gold. Device Assembly ...
Description 0.25-16 GHz, Cascadable pHEMT MMIC Amplifier

File Size 132.14K  /  4 Page

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    SIRENZA[SIRENZA MICRODEVICES]
Part No. SUF-4000
OCR Text .... 2. No connection required for unlabeled bond pads. 3. Die Thickness is 0.004 (0.100). 4. Typical bond pad is 0.004 (0.100) square. 5. Backside metalization: Gold. 6. Backside is Ground. 7. Bond pad metalization: Gold. Device Assembly ...
Description 0.15-10 GHz, Cascadable pHEMT MMIC Amplifier

File Size 130.81K  /  4 Page

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    SIRENZA[SIRENZA MICRODEVICES]
Part No. SUF-5000
OCR Text .... 2. No connection required for unlabeled bond pads. 3. Die Thickness is 0.004 (0.100). 4. Typical bond pad is 0.004 (0.100) square. 5. Backside metalization: Gold. 6. Backside is Ground. 7. Bond pad metalization: Gold. Device Assembly ...
Description 0.1-3.7 GHz, Cascadable pHEMT MMIC Amplifier

File Size 106.03K  /  4 Page

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    HMC-ALH376

Hittite Microwave Corporation
Part No. HMC-ALH376
OCR Text ... 6. CONNECTION NOT REQUIRED FOR unlabeled BOND PADS. 7. OVERALL DIE SIZE .002" 0 - 36 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax:...
Description GaAs HEMT MMIC LOW NOISE AMPLIFIER, 35 - 45 GHz

File Size 118.15K  /  3 Page

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    HMC-ALH444

Hittite Microwave Corporation
Part No. HMC-ALH444
OCR Text ... 6. CONNECTION NOT REQUIRED FOR unlabeled BOND PADS. 7. OVERALL DIE SIZE .002" 0 - 50 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax:...
Description GaAs HEMT MMIC LOW NOISE AMPLIFIER, 1 - 12 GHz

File Size 125.73K  /  3 Page

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    HMC-AUH232

Hittite Microwave Corporation
Part No. HMC-AUH232
OCR Text ... 6. CONNECTION NOT REQUIRED FOR unlabeled BOND PADS. 7. OVERALL DIE SIZE .002" 0-6 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 97...
Description GaAs HEMT MMIC MODULATOR DRIVER AMPLIFIER, DC - 43 GHz

File Size 209.14K  /  5 Page

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    HMC45907

Hittite Microwave Corporation
Part No. HMC45907
OCR Text ...] 2. NO CONNECTION REQUIRED FOR unlabeled BOND PADS 3. DIE THICKNESS IS 0.004 (0.100) 4. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE 5. BACKSIDE METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND 7. BOND PAD METALIZATION: GOLD For price, deliv...
Description GaAs PHEMT MMIC POWER AMPLIFIER, DC - 18 GHz

File Size 284.33K  /  8 Page

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    HMC608

Hittite Microwave Corporation
Part No. HMC608
OCR Text ...] 2. NO CONNECTION REQUIRED FOR unlabeled BOND PADS 3. DIE THICKNESS IS 0.004 (0.100) 4. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE 5. BACKSIDE METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND 7. BOND PAD METALIZATION: GOLD 3 - 108 For p...
Description GaAs PHEMT MEDIUM POWER AMPLIFIER, 9.5 - 11.5 GHz

File Size 370.53K  /  8 Page

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    HMC609

Hittite Microwave Corporation
Part No. HMC609
OCR Text ...D 7. NO CONNECTION REQUIRED FOR unlabeled BOND PADS 8. OVERALL DIE SIZE 0.002" For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3...
Description GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 2 - 4 GHz

File Size 298.72K  /  6 Page

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