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SIRENZA[SIRENZA MICRODEVICES]
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Part No. |
SUF-2000
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OCR Text |
.... 2. No connection required for unlabeled bond pads. 3. Die Thickness is 0.004 (0.100). 4. Typical bond pad is 0.004 (0.100) square. 5. Backside metalization: Gold. 6. Backside is Ground. 7. Bond pad metalization: Gold.
Device Assembly
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Description |
0.2-10 GHz, Cascadable pHEMT MMIC Amplifier
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File Size |
148.34K /
4 Page |
View
it Online |
Download Datasheet |
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SIRENZA[SIRENZA MICRODEVICES]
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Part No. |
SUF-3000
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OCR Text |
.... 2. No connection required for unlabeled bond pads. 3. Die Thickness is 0.004 (0.100). 4. Typical bond pad is 0.004 (0.100) square. 5. Backside metalization: Gold. 6. Backside is Ground. 7. Bond pad metalization: Gold.
Device Assembly
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Description |
0.25-16 GHz, Cascadable pHEMT MMIC Amplifier
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File Size |
132.14K /
4 Page |
View
it Online |
Download Datasheet |
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SIRENZA[SIRENZA MICRODEVICES]
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Part No. |
SUF-4000
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OCR Text |
.... 2. No connection required for unlabeled bond pads. 3. Die Thickness is 0.004 (0.100). 4. Typical bond pad is 0.004 (0.100) square. 5. Backside metalization: Gold. 6. Backside is Ground. 7. Bond pad metalization: Gold.
Device Assembly
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Description |
0.15-10 GHz, Cascadable pHEMT MMIC Amplifier
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File Size |
130.81K /
4 Page |
View
it Online |
Download Datasheet |
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SIRENZA[SIRENZA MICRODEVICES]
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Part No. |
SUF-5000
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OCR Text |
.... 2. No connection required for unlabeled bond pads. 3. Die Thickness is 0.004 (0.100). 4. Typical bond pad is 0.004 (0.100) square. 5. Backside metalization: Gold. 6. Backside is Ground. 7. Bond pad metalization: Gold.
Device Assembly
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Description |
0.1-3.7 GHz, Cascadable pHEMT MMIC Amplifier
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File Size |
106.03K /
4 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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