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ST78L06U C1008 5R100B 1N60T 10D27 044067 ST78L06U 2SD330
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  w baked Datasheet PDF File

For w baked Found Datasheets File :: 835    Search Time::1.391ms    
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    TJ100F06M3L

Toshiba Semiconductor
Part No. TJ100F06M3L
OCR Text ...84 -100 175 -55 to 175 unit v a w mj a note: using continuously under heavy loads (e.g. the application of high temperature/curre...baked as follows: baking conditions: 125 for 48 hours. note: since the tape materials are not heat...
Description MOSFETs

File Size 291.76K  /  10 Page

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    TJ150F04M3L

Toshiba Semiconductor
Part No. TJ150F04M3L
OCR Text ...55 -150 175 -55 to 175 unit v a w mj a note: using continuously under heavy loads (e.g. the application of high temperature/curre...baked as follows: baking conditions: 125 for 48 hours. note: since the tape materials are not heat...
Description MOSFETs

File Size 276.94K  /  10 Page

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    TJ120F06J3

Toshiba Semiconductor
Part No. TJ120F06J3
OCR Text ... 2.54 0.25 0.1 0.1 A w mJ A mJ C C 6.8 V 2.76 1. 2. 8.0 GATE DRAIN HEAT SINK 3. SOURSE Drain power dissipation ...baked as follows: Baking conditions: 125C for 48 hours. Since the tape materials are not heat-proof,...
Description Chopper Regulator, DC-DC Converter Applications Motor Drive Applications

File Size 211.99K  /  7 Page

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    TLWA1100T11 TLWA1100

Toshiba Semiconductor
Part No. TLwA1100T11 TLwA1100
OCR Text ...ce-mount devices 3.2 (L) x 2.9 (w) x 1.9 (H) mm UV LED chip + RGB phosphor Luminous intensity : Iv = 100 mcd (typ.) @20mA Colors: white Chro...baked while packed in the tape reel. After baking, use the baked devices within 72 hours, but perfor...
Description Panel Circuit Indicator

File Size 265.52K  /  8 Page

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    TLWD1100T11 TLWD1100

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Toshiba Semiconductor
Part No. TLwD1100T11 TLwD1100
OCR Text ...ce-mount devices 3.2 (L) x 2.8 (w) x 1.9 (H) mm LED chip + phosphor Luminous intensity : Iv = 180 mcd (typ.) @20mA Color: white Chromaticity...baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking o...
Description Panel Circuit Indicator

File Size 271.97K  /  9 Page

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    TLWH1100T11 TLWH1100

Toshiba Corporation
Toshiba Semiconductor
Part No. TLwH1100T11 TLwH1100
OCR Text ...ce-mount devices 3.2 (L) x 2.8 (w) x 1.9 (H) mm UV LED chip + phosphor Luminous intensity : Iv = 450 mcd (typ.) @20mA Color: white Chromatic...baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking o...
Description Zener Diode; Application: General; Pd (mw): 200; Vz (V): 12.91 to 13.49; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK
Zener Diode; Application: General; Pd (mw): 200; Vz (V): 12.47 to 13.03; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK
Panel Circuit Indicator

File Size 269.62K  /  8 Page

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    TLWJ1100T11 TLWJ1100

Toshiba Corporation
Toshiba Semiconductor
Part No. TLwJ1100T11 TLwJ1100
OCR Text ...ce-mount devices 3.2 (L) x 2.8 (w) x 1.9 (H) mm LED chip + phosphor Luminous intensity : Iv = 750 mcd (typ.) @20mA Color: white Chromaticity...baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking o...
Description Zener Diode; Application: General; Pd (mw): 200; Vz (V): 13.84 to 15.52; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK
Zener Diode; Application: General; Pd (mw): 200; Vz (V): 13.37 to 13.96; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK
Panel Circuit Indicator

File Size 272.05K  /  9 Page

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    TLWK1100BT11 TLWK1100B

Toshiba Corporation
Toshiba Semiconductor
Part No. TLwK1100BT11 TLwK1100B
OCR Text ...ce-mount devices 3.2 (L) x 2.9 (w) x 1.9 (H) mm LED chip + phosphor Luminous intensity : Iv = 1500 mcd (typ.) @20mA Color: white Topr / Tstg...baked in taping with reel. After baking, use the baked device within 72 hours, but perform baking on...
Description Zener Diode; Application: General; Pd (mw): 200; Vz (V): 14.34 to 14.98; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK
Zener Diode; Application: General; Pd (mw): 200; Vz (V): 13.84 to 14.46; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MPAK
Panel Circuit Indicator

File Size 253.25K  /  9 Page

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    TLBA1100B

Toshiba Semiconductor
Part No. TLBA1100B
OCR Text ...ce-mount devices 3.2 (L) x 2.8 (w) x 1.9 (H) mm Flat-top type GaN LED Low drive current, high-intensity light emission Colors: Blue d=465nm(...baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking o...
Description Panel Circuit Indicator

File Size 221.11K  /  8 Page

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    TLEGC1002 TLBC1002

Toshiba Semiconductor
Part No. TLEGC1002 TLBC1002
OCR Text ...e-mount devices 2.0 (L) x 1.25 (w) x 1.1 (H) mm InGaN LEDs High luminous intensity Low drive current, high-intensity light emission Colors: ...baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking o...
Description Panel Circuit Indicator

File Size 270.68K  /  11 Page

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For w baked Found Datasheets File :: 835    Search Time::1.391ms    
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