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Amphenol Communications Solutions |
| Part No. |
61083-164602LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77316-444LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 7 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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SIEMENS AG
Infineon Technologies AG
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| Part No. |
HYB3165405AJ-40 HYB3164405AJ-40 HYB3164405AT-50 HYB3164405AT-40 HYB3165405AT-40 HYB3165405AJ-60 HYB3165405AJ-50
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| Description |
High-Speed Fully-Differential Amplifiers 8-SOIC 0 to 70
16M X 4 EDO DRAM, 40 ns, PDSO32 0.400 INCH, PLASTIC, SOJ-32
16M X 4 EDO DRAM, 40 ns, PDSO32 0.400 INCH, PLASTIC, TSOP2-32
16M x 4-Bit Dynamic RAM 16M X 4 EDO DRAM, 60 ns, PDSO32
16M x 4-Bit Dynamic RAM 16M X 4 EDO DRAM, 50 ns, PDSO32
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| File Size |
334.00K /
29 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
61083-164409LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
61083-164422LF
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| Description |
BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
86503-164HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 64 Positions, 2.54 mm Pitch, Vertical, 6.35 mm (0.25 in.) Mating, 3.05 mm (0.12 in.) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
GSB316441CEU
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| Description |
USB 3.2, Type A, Plug, Right Angle SMT, 9 Pins, Offset 0.95mm, 3.2mm Height, Shell Dip with Nickel Plating, 30u\\ Gold, Blue High Temperature Housing, Tape and Reel Packaging
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-6414-21D
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-6418-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
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| Tech specs |
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Official Product Page
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http://
Infineon Technologies AG
SIEMENS AG
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| Part No. |
HYB3165405BT-40 HYB3164405BT-40 HYB3164405BJ-40 HYB3165405BJ-40 HYB3164405BJ-50 HYB3164405BTL-60 HYB3165405BJ-60 HYB3165405BJ-50
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| Description |
16M x 4-Bit Dynamic RAM 16M X 4 EDO DRAM, 50 ns, PDSO32
16M x 4-Bit Dynamic RAM 16M X 4 EDO DRAM, 40 ns, PDSO32
16M X 4 EDO DRAM, 40 ns, PDSO32 0.400 INCH, PLASTIC, SOJ-32
16M X 4 EDO DRAM, 40 ns, PDSO32 0.400 INCH, PLASTIC, TSOP2-32
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| File Size |
307.00K /
29 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
RJE031640123
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| Description |
Modular Jack - 6P4C, Right Angle, Low Profile, Single Port, No Shield, With Panel Stops
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77316-448LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 3 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 310-0025 |
| Maker: THAILAND |
| Pack: DIP/14P |
| Stock: 6 |
| Unit price
for : |
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50: $2.77 |
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100: $2.63 |
| 1000:
$2.49 |
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Email: oulindz@gmail.com |
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Contact us |
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