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Amphenol Communications Solutions |
| Part No. |
77313-427-04LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 04 Positions
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| Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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| Part No. |
PSMN1R7-25YLC
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| Description |
N-channel 25 V 1.9 m logic level MOSFET in LFPAK using NextPower technology
N-channel 25 V 1.9 mΩ logic level MOSFET in LFPAK using NextPower technology
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| File Size |
329.47K /
15 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
UE86B642700621
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| Description |
ExpressPort SFP+, High Speed Input Output Connectors, 2X6 SFPP COMBO NO LP.
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| Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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| Part No. |
PSMN1R9-25YLC
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| Description |
N-channel 25 V 2.05 mlogic level MOSFET in LFPAK using NextPower technology
N-channel 25 V 2.05 m logic level MOSFET in LFPAK using NextPower technology
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| File Size |
342.35K /
15 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10142708-08000LF
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| Description |
Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 8 Positions, 30u\\ Gold (100u\\ Tin on Tails) plating, GW Compatible LCP, With Pegs, Tray.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10142708-06200LF
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| Description |
Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 6 Positions, 100u\\ Tin overall plating, GW Compatible LCP, With Pegs, Tray.
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| Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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| Part No. |
PSMN2R2-25YLC
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| Description |
N-channel 25 V 2.4 m logic level MOSFET in LFPAK using NextPower technology
N-channel 25 V 2.4 mΩ logic level MOSFET in LFPAK using NextPower technology
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| File Size |
330.59K /
15 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77311-427-03LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 03 Positions, 2.54 mm Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
94270-008TRLF
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| Description |
<span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 57202</b></span><br><br>Minitek® 2.00mm, Board/Wire to Board Connector, Unshrouded Vertical Header, Surface Mount, Double Row, 8 Position ,2.00mm (0.079in) Pitch.
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Official Product Page
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NXP Semiconductors N.V.
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| Part No. |
PSMN012-25YLC
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| Description |
N-channel 25 V 12.6 m logic level MOSFET in LFPAK using NextPower technology
N-channel 25 V 12.6 mlogic level MOSFET in LFPAK using NextPower technology
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| File Size |
209.33K /
15 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
85854-270LF
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| Description |
5 Row Signal Header, Straight, Press-Fit, Wide body, 4 Mod
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| Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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| Part No. |
PSMN0R9-25YLC
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| Description |
N-channel 25 V 0.99 m logic level MOSFET in LFPAK using NextPower technology
N-channel 25 V 0.99 mΩ logic level MOSFET in LFPAK using NextPower technology
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| File Size |
311.48K /
15 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-427-00LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 02 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10142707-06LF
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| Description |
Minitek®Pwr 5.7, Receptacle Housing, 6 Positions, Black Color, GW Compatible Nylon66. .
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10142708-06100LF
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| Description |
Minitek®Pwr 5.7, Vertical Through Hole Header, Dual Row, Black Color, 6 Positions, 15u\\ Gold (100u\\ Tin on Tails) plating, GW Compatible LCP, With Pegs, Tray.
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| Tech specs |
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Official Product Page
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Price and Availability
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