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  550-3609 Datasheet PDF File

For 550-3609 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
Part No. R550
Description PHOTOMULTIPLIER TUBE

File Size 19.10K  /  2 Page

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Amphenol Communications Solutions

Part No. 61083-203609LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    HC-5504

Intersil Corporation
Part No. HC-5504
Description ITU Low Cost/ PABX SLIC With 40mA Loop Feed

File Size 87.92K  /  9 Page

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Amphenol Communications Solutions

Part No. 61082-043609LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 40 Positions.
Tech specs    

Official Product Page

    M-G550-PC

Epson Company
Part No. M-G550-PC
Description IMU (Inertial Measurement Unit)

File Size 190.74K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-107360950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    M-G550-PR

Epson Company
Part No. M-G550-PR
Description IMU (Inertial Measurement Unit)

File Size 185.29K  /  2 Page

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Amphenol Communications Solutions

Part No. 61083-063609LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 60 Positions.
Tech specs    

Official Product Page

    Kycon, Inc.
Part No. ST-2550-3N-TR ST-2550-4N-TR
Description
File Size 121.63K  /  1 Page

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Amphenol Communications Solutions

Part No. 61082-203609LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 200 Positions.
Tech specs    

Official Product Page

   
Part No. 4550
Description From old datasheet system

File Size 213.84K  /  19 Page

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Amphenol Communications Solutions

Part No. 61082-123609LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 120 Positions.
Tech specs    

Official Product Page

    15-47-7550

Molex Electronics Ltd.
Part No. 15-47-7550
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, Tin (Sn) Plating

File Size 377.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 54121-407360940LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. 2550
Description From old datasheet system

File Size 479.77K  /  16 Page

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Amphenol Communications Solutions

Part No. 61083-183609LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 180 Positions.
Tech specs    

Official Product Page

    DIALIGHT CORP
Part No. 550-5506
Description SINGLE COLOR LED, RED, 5 mm

File Size 173.78K  /  2 Page

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Amphenol Communications Solutions

Part No. 61083-103609LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 100 Positions.
Tech specs    

Official Product Page

    SAMSUNG[Samsung semiconductor]
Part No. K7A803609A K7A801809A
Description 256Kx36 & 512Kx18 Synchronous SRAM

File Size 363.62K  /  20 Page

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Amphenol Communications Solutions

Part No. 59202-F36-09A105LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 18 Positions.
Tech specs    

Official Product Page

For 550-3609 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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