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Molex Electronics Ltd.
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| Part No. |
75757-0231 0757570231
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail,
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail,
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| File Size |
99.21K /
3 Page |
 View
it Online |
Download Datasheet
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Rochester Electronics LLC |
| Part No. |
AM27C512-120DE
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| Description |
AM27C512 - 512K (64K x 8) CMOS EPROM
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| Tech specs |
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Official Product Page
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Rochester Electronics LLC |
| Part No. |
AM27C512-150DI
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| Description |
AM27C512 - 512K (64K x 8) CMOS EPROM
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| Tech specs |
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Official Product Page
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Rochester Electronics LLC |
| Part No. |
27C512-150JI
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| Description |
27C512 - 512K (64K x 8) CMOS EPROM
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| Tech specs |
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Official Product Page
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Rochester Electronics LLC |
| Part No. |
AM27C512-120DC
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| Description |
AM27C512 - 512K (64K x 8) CMOS EPROM
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
http://
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| Part No. |
0757576441 75757-6441
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| Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail Length
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| File Size |
166.19K /
4 Page |
View
it Online |
Download Datasheet |
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Rochester Electronics LLC |
| Part No. |
AM27C512-120PI-G
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| Description |
AM27C512 - 512Kb (64K x 8-Bit) CMOS OTP EPROM
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10137925-1211LF
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| Description |
Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 12 Positions, GW Compatible LCP, Tape and Reel. .
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68655-121HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318in) Mating, 7.37 mm (0.29in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0322 0757570322
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
98.95K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10139085-121402LF
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| Description |
BergStak+™ 0.80mm Mezzanine Connector, Board To Board Connectors, 120 Positions, Dual Row, BTB Vertical Header, P1.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10131935-121ULF
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| Description |
Minitek®, Board to Board, Receptacle, Surface Mount, Single row, 21 Positions, 2mm (0.079inch), Vertical.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-6261 0757576261
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| Description |
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on
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| File Size |
166.28K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
L17TF1512115
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| Description |
Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 15 Pin, Bright Tin Shell+Grounding Dimples, 0.76um(30 in) Gold, M3 Threaded Boardlock with M3 Front Screwlock Installed
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Official Product Page
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Bom2Buy.com
Price and Availability
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