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  75757-5161 Datasheet PDF File

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    75757-0331 0757570331

Molex Electronics Ltd.
Part No. 75757-0331 0757570331
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

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Amphenol Communications Solutions

Part No. 51617-XX002LF
Description PwrBlade®, Power Supply Connectors, 5P 24S 1M 7P PF Vertical Receptacle.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    75757-0352 0757570352

Molex Electronics Ltd.
Part No. 75757-0352 0757570352
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.22K  /  3 Page

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Amphenol Communications Solutions

Part No. 84516-102
Description 200 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    75757-0252 0757570252

Molex Electronics Ltd.
Part No. 75757-0252 0757570252
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-3516-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-0251 0757570251

Molex Electronics Ltd.
Part No. 75757-0251 0757570251
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-8516-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-0241 0757570241

Molex Electronics Ltd.
Part No. 75757-0241 0757570241
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25um (50u) Nickel (Ni) Overall

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-7516-11H
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    75757-0222 0757570222

Molex Electronics Ltd.
Part No. 75757-0222 0757570222
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits

File Size 98.95K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-516122300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    75757-0221 0757570221

Molex Electronics Ltd.
Part No. 75757-0221 0757570221
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 98.95K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-7516-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    75757-0261 0757570261

Molex Electronics Ltd.
Part No. 75757-0261 0757570261
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.22K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6516-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    75757-0262 0757570262

Molex Electronics Ltd.
Part No. 75757-0262 0757570262
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.22K  /  3 Page

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Amphenol Communications Solutions

Part No. F516-1A7H1-21014
Description Flex Connector, 1.00mm Pitch, Height 2.00mm, Right angle, Flip type, ZIF, 14 position, With MYLAR
Tech specs    

Official Product Page

    0757570151 75757-0151

Molex Electronics Ltd.
Part No. 0757570151 75757-0151
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating Overall
MOLEX Connector

File Size 99.39K  /  3 Page

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Amphenol Communications Solutions

Part No. 10137925-1612LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 16 Positions, Non GW Compatible LCP, Tape and Reel. .
Tech specs    

Official Product Page

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