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  76135-8501 Datasheet PDF File

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    85013-0414 0850130414

Molex Electronics Ltd.
Part No. 85013-0414 0850130414
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, Style R Reverse,1um (40 u) Selective Gold (Au)

File Size 125.70K  /  5 Page

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Rochester Electronics LLC

Part No. 8501002YC
Description 8501002YC - Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68 - Dual marked (MQ80186-6/BYC)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0850132464

Molex Electronics Ltd.
Part No. 0850132464
Description 2.54mm (.100) Pitch DIN 41612 Header, C-Pin Press-Fit Style R Reverse, 96 Circuits

File Size 69.74K  /  3 Page

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Rochester Electronics LLC

Part No. 8501001YA
Description 80186 - High-Integration 16-Bit Microprocessor, CQFP68 (8501001YA)
Tech specs    

Official Product Page

    0850133225 85013-3225

Molex Electronics Ltd.
Part No. 0850133225 85013-3225
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 64 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 64 Circuits, Lead free

File Size 125.17K  /  5 Page

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Amphenol Communications Solutions

Part No. 91276-135HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs    

Official Product Page

    0850132127 85013-2127

Molex Electronics Ltd.
Part No. 0850132127 85013-2127
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1μm (40μ) Selective Gold (Au), 48 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 1楼矛m (40楼矛) Selective Gold (Au), 48 Circuits, Lead free

File Size 159.01K  /  6 Page

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Amphenol Communications Solutions

Part No. 95278-501-42LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    0850130062 85013-0062

Molex Electronics Ltd.
Part No. 0850130062 85013-0062
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R/2 Reverse0.6μm (24μ) Selective Gold (Au), 32 Circuits, Lead free
2.54mm (.100") Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R/2 Reverse0.6楼矛m (24楼矛") Selective Gold (Au), 32 Circuits, Lead free

File Size 312.27K  /  6 Page

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Amphenol Communications Solutions

Part No. 95278-501-46LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85015-0024 0850150024

Molex Electronics Ltd.
Part No. 85015-0024 0850150024
Description 2.54mm (.100) Pitch DIN 41612 Header, 4-Row C-Pin, Press-Fit Style R Reverse, 0.6μm (24μ) Selective Gold (Au), 128 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, 4-Row C-Pin, Press-Fit Style R Reverse, 0.6楼矛m (24楼矛) Selective Gold (Au), 128 Circuits, Lead free

File Size 67.71K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-501A16LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85013-3299 0850133299

Molex Electronics Ltd.
http://
Part No. 85013-3299 0850133299
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1μm (40μ) Selective Gold (Au), 96 Circuits, Lead free

File Size 67.57K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-501A40LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    87758-5017 0877585017

Molex Electronics Ltd.
Part No. 87758-5017 0877585017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
   2.00mm (.079) Pitch Milli-Grid?Header, Through Hole, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.76K  /  4 Page

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Amphenol Communications Solutions

Part No. 95278-501B20LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85013-1108 0850131108

Molex Electronics Ltd.
Part No. 85013-1108 0850131108
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, Style R Reverse, 0.6um (24u) Selective Gold (Au)

File Size 130.64K  /  5 Page

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Amphenol Communications Solutions

Part No. 95278-501B40LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    85017-0115 0850170115

Molex Electronics Ltd.
Part No. 85017-0115 0850170115
Description 2.54mm (.100) Pitch DIN 41612/EIC 603-2 Mixed Layout Connector, Male Style M (Hybrid type)

File Size 208.50K  /  6 Page

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Amphenol Communications Solutions

Part No. RJCSE508501
Description Modular Jack - Right Angle, Input Output Connectors 8P8C, Without Shield, With LEDs.
Tech specs    

Official Product Page

For 76135-8501 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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