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  8192-3162 Datasheet PDF File

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    AK5368192WP-70

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ACCUTEK MICROCIRCUIT CORPORATION
Part No. AK5368192WP-70
Description 8,388,608 by 36 Bit CMOS Dynamic Random Access Memory

File Size 116.94K  /  2 Page

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Amphenol Communications Solutions

Part No. 61083-162602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    AK5328192WP-60

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ACCUTEK MICROCIRCUIT CORPORATION
Part No. AK5328192WP-60
Description 8,388,608 by 32 Bit CMOS Dynamic Random Access Memory

File Size 72.47K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-3316-21D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    HIROSE ELECTRIC Co., Ltd.
Part No. AK5328192WP-60 AK5328192WP-70
Description x32 Fast Page Mode DRAM Module X32号快速页面模式内存模
x32FastPageModeDRAMModule

File Size 71.04K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-6214-21D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    STEC, Inc.
Part No. AT1830I-256 AT1830I-256C AT1830-6144 AT1830-8192C AT1830I-2048 AT1830I-1024 AT1830I-1024C AT1830I-4096 AT1830I-4096C AT1830I-2048C AT1830I-8192C
Description
File Size 101.58K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-8316-21D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    HIROSE ELECTRIC Co., Ltd.
Part No. AK5368192WP-80 AK5368192WP-60
Description x36 Fast Page Mode DRAM Module x36快速页面模式内存模

File Size 266.83K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-6218-21H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Double End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    0923162652 SD-92316-001

Molex Electronics Ltd.
Part No. 0923162652 SD-92316-001
Description Picoflex PF-50 IDT-Board In, 26 Circuits,0.52m (1.71 ) Length

File Size 96.89K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-7316-21H
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    SD-92316-001 0923162016

Molex Electronics Ltd.
Part No. SD-92316-001 0923162016
Description Picoflex PF-50 IDT-Board In, 20 Circuits, 0.16m (6.30) Length

File Size 96.90K  /  2 Page

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Amphenol Communications Solutions

Part No. 85713-162LF
Description 4 Row Signal Header, Straight, Press-Fit, 1 Mod
Tech specs    

Official Product Page

    Panasonic, Corp.
Part No. AT27C8192-15RI AT27C8192-12TC AT27C8192-10TC AT27C8192-15TC AT27C8192-12PC AT27C8192-12PI AT27C8192-10TI
Description x8/x16 EPROM x8/x16存储

File Size 459.48K  /  9 Page

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Amphenol Communications Solutions

Part No. 61083-162422LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    CIRRUS[Cirrus Logic]
Part No. CXT8192U CXT6176 CXT6176U CXT8192 CXT8192A
Description PULLABLE QUARTZ CRYSTALS

File Size 77.25K  /  4 Page

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Amphenol Communications Solutions

Part No. 61083-162409LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

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    Air Cost Control
Part No. AT49BV8192A-11CI
Description EEPROM|FLASH|512KX16/1MX8|CMOS|BGA|48PIN|PLASTIC 的EEPROM | FLASH动画| 512KX16/1MX8 |的CMOS | BGA封装| 48PIN |塑料

File Size 205.65K  /  20 Page

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Amphenol Communications Solutions

Part No. 131-6214-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 4 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For 8192-3162 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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