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  85013-3304 Datasheet PDF File

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    SP3304N SP3304NUTG

Littelfuse
Part No. SP3304N SP3304NUTG
Description The SP3304N integrates 4 channels of low capacitance diodes with an additional zener diode to protect sensitive I/O pins against lightning induced surge events and ESD.
File Size 968.27K  /  4 Page

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Texas Instruments
Part No. TPS65033304RGERQ1
Description 18-V PMIC with 3 buck converters and 1 LDO for camera modules up to ASIL B 24-VQFN -40 to 125
Tech specs 　 　

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HUA FENG CIRCUIT





    UN Semiconducctor INC
Part No. ULC3304P10
Description Transient Voltage Suppressors Array for ESD Protection
File Size 523.18K  /  4 Page

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Amphenol Communications Solutions
Part No. 95278-501-36LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

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    503304-2610 5033042610

Molex Electronics Ltd.
Part No. 503304-2610 5033042610
Description 0.40mm (.016) Pitch SlimStack Board-to-Board Receptacle, SMT, Dual Row, Vertical
File Size 384.28K  /  6 Page

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Amphenol Communications Solutions
Part No. 95278-501-30LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

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    0441330400 44133-0400

Molex Electronics Ltd.
Part No. 0441330400 44133-0400
Description 3.00mm (.118) Micro-Fit 3.0 BMI Receptacle Housing, Dual Row, Panel Mount, 4 Circuits, PBT Polyester, UL 94V-0
File Size 170.56K  /  2 Page

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Amphenol Communications Solutions
Part No. 95278-501-34LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

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    Socay Electornics Co., ...
Part No. ULC3304P10
Description Transient Voltage Suppressors Array for ESD Protection
File Size 366.36K  /  4 Page

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Amphenol Communications Solutions
Part No. 95278-501-38LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

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    0151330400

Molex Electronics Ltd.
Part No. 0151330400
Description Pico-Clasp-to-Pico-Clasp Off-the-Shelf (OTS) Cable Assembly, Single Row
File Size 35.41K  /  1 Page

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Amphenol Communications Solutions
Part No. 95278-501-32LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs 　 　

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    0151330401

Molex Electronics Ltd.
Part No. 0151330401
Description Pico-Clasp-to-Pico-Clasp Off-the-Shelf (OTS) Cable Assembly, Single Row
File Size 35.41K  /  1 Page

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Analog Devices
Part No. ADG3304BRUZ-REEL
Description 1.2 V - 5.5 V, 4-channel BI-DI
Tech specs 　 　

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    0151330406

Molex Electronics Ltd.
Part No. 0151330406
Description Pico-Clasp-to-Pico-Clasp Off-the-Shelf (OTS) Cable Assembly, Single Row
File Size 35.41K  /  1 Page

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Analog Devices
Part No. ADG3304BCPZ-REEL7
Description 1.2 V - 5.5 V, 4 channel BI-DI
Tech specs 　 　

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    BA3304F A5801025

Rohm CO.,LTD.
Part No. BA3304F A5801025
Description 3V Dual Preamplifier(双前置放大器)
From old datasheet system
File Size 90.44K  /  6 Page

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Analog Devices
Part No. LTC3304ARUCM#TRPBF
Description 5V, 6A, Synchronous Buck DC/DC
Tech specs 　 　

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    FC8J33040L

Panasonic Semiconductor
Part No. FC8J33040L
Description FC8J33040L Dual N-channel MOSFET
File Size 295.11K  /  7 Page

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Analog Devices
Part No. ADG3304WBRUZ-REEL
Description 1.2 V - 5.5 V, 4-channel BI-DI
Tech specs 　 　

Official Product Page

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