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  BFCN-7900 Datasheet PDF File

For BFCN-7900 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    0638007900

Molex Electronics Ltd.
Part No. 0638007900
Description Application Tooling Specification Sheet

File Size 759.02K  /  4 Page

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Amphenol Communications Solutions

Part No. 87900-102HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 2 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0907790004

Molex Electronics Ltd.
Part No. 0907790004
Description 1.27mm (.050) Pitch Picoflex PF-50 Header, Vertical, Low Profile, High Temperature Surface

File Size 155.38K  /  3 Page

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Amphenol Communications Solutions

Part No. 87900-124HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 24 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    SI7900AEDN-T1

Vishay Siliconix
Part No. SI7900AEDN-T1
Description Dual N-Channel 20-V (D-S) MOSFET, Common Drain

File Size 539.46K  /  12 Page

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Amphenol Communications Solutions

Part No. 87900-146HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    0907790001

Molex Electronics Ltd.
Part No. 0907790001
Description 1.27mm (.050) Pitch Picoflex PF-50 Header, Vertical, Low Profile, High Temperature Surface

File Size 155.38K  /  3 Page

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Amphenol Communications Solutions

Part No. 87900-166HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 66 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    Vishay Intertechnology, Inc.
Part No. CLR790025 CLR790025H
Description CAPACITOR, TANTALUM, NON SOLID, POLARIZED, 8 V, 56 uF, THROUGH HOLE MOUNT AXIAL LEADED

File Size 625.29K  /  3 Page

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Amphenol Communications Solutions

Part No. 87900-414HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    TOSHIBA
Part No. TA79010S TA79009S
Description Output Current of 1A, Three-Terminal Negative Voltage Regulators -10V
Output Current of 1A, Three-Terminal Negative Voltage Regulators -9V

File Size 255.12K  /  18 Page

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Amphenol Communications Solutions

Part No. 87900-434HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    Powerex Power Semicondu...
Part No. QIS1790001
Description Single IGBT Module 900 Amperes/1700 Volts

File Size 433.82K  /  8 Page

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Amphenol Communications Solutions

Part No. 87900-454HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 54 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    1728790003

Molex Electronics Ltd.
Part No. 1728790003
Description    3.96mm Pitch EdgeMate Wire-to-Board Edge Card Connector, Female, Nylon 6,

File Size 48.90K  /  2 Page

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Amphenol Communications Solutions

Part No. 95679-002
Description Modular Jack, CAT 5, Standard, 8P8C, Right Angle, Through Hole, Without Shield, Snap Peg, 2 Port
Tech specs    

Official Product Page

    TQP879001A

TriQuint Semiconductor
Part No. TQP879001A
Description 2.4GHz WLAN LNA SP3T Switch

File Size 160.64K  /  1 Page

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Amphenol Communications Solutions

Part No. 87900-112HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 12 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

    0438790034

Molex Electronics Ltd.
Part No. 0438790034
Description MINI-FIT JR BMI/CPI HEADER ASSEMBLY

File Size 193.82K  /  2 Page

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Amphenol Communications Solutions

Part No. 87900-132HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

For BFCN-7900 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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