CGA-6618 pdf Datasheet P11 Part Num --- IC-ON-LINE


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CGA-6618 Datasheet PDF File

For CGA-6618 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |

					TDK Electronics
Part No.	CGA4J1X7R0J106M125AC-17
Description	Multilayer Ceramic Chip Capacitors
File Size	232.37K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-21H
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs				Official Product Page

HUA FENG CIRCUIT

					TDK Electronics
Part No.	CGA4J3X7R1C225M125AB-17
Description	Multilayer Ceramic Chip Capacitors
File Size	231.83K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-21D
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA4J3X7R1C335K125AD
Description	Multilayer Ceramic Chip Capacitors
File Size	130.55K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-0200LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 2 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA4J3X7R1C225K125AB
Description	Multilayer Ceramic Chip Capacitors
File Size	130.92K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-1200LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 12 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA4J1X7R0J685K125AC-17
Description	Multilayer Ceramic Chip Capacitors
File Size	232.52K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-1100LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 11 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA6P2X8R1E335K250AE
Description	Multilayer Ceramic Chip Capacitors
File Size	228.39K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-0400LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 4 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA8P2X7R1E106K250KA-17
Description	Multilayer Ceramic Chip Capacitors
File Size	231.92K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10156618-1400LF
Description	Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 14 positions
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA5H2C0G2A822J115AA
Description	Automotive Grade ( Mid Voltage (100 to 630V) )
File Size	123.54K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	DWRT200PM16618
Description	COOLPOWER MEZZANINE
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA5H2C0G1H473J115AA
Description	Automotive Grade ( General (Up to 50V) )
File Size	123.83K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-11H
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs				Official Product Page

					TDK Electronics
Part No.	CGA5H2C0G1H473J115AE
Description	Multilayer Ceramic Chip Capacitors
File Size	162.11K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	131-6618-11D
Description	Paladin® 112Gb/s Backplane Connector, 6-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs				Official Product Page

For CGA-6618 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |

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