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  HG-0713 Datasheet PDF File

For HG-0713 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    0713085414 71308-5414

Molex Electronics Ltd.
Part No. 0713085414 71308-5414
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 89007-136LF
Description Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0713085412 71308-5412

Molex Electronics Ltd.
Part No. 0713085412 71308-5412
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 77315-107-13LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0713085410 71308-5410

Molex Electronics Ltd.
Part No. 0713085410 71308-5410
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 10 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 10 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z1054071321
Description QSFP STACKED COMBO NO LP
Tech specs    

Official Product Page

    0713085408 71308-5408

Molex Electronics Ltd.
Part No. 0713085408 71308-5408
Description 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 1.50um (59u") Minimum
2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 1.50um (59u) Minimum

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 78207-130
Description PV®Wire-to-Board Connector System, 2 Wall Shrouded Right angled Header - Through Hole - Double row - 30 Positions, 2.54mm (0.100in) pitch.
Tech specs    

Official Product Page

    0713085406 71308-5406

Molex Electronics Ltd.
Part No. 0713085406 71308-5406
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Daughterboard Power Module, RightAngle, SMC, 3-Blade Module, 3 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Daughterboard Power Module, RightAngle, SMC, 3-Blade Module, 3 Circuits

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z2054071341
Description QSFP 2X2 COMBO SP FG NO LP
Tech specs    

Official Product Page

    0713085404 71308-5404

Molex Electronics Ltd.
Part No. 0713085404 71308-5404
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 77315-407-13LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0930713001 93071-3001

Molex Electronics Ltd.
http://
Part No. 0930713001 93071-3001
Description 5.00mm (.197") Pitch Appli-Mate RAST 2.5 Header, Vertical, 5 Circuits, Reference K00, Glow Wire
5.00mm (.197) Pitch Appli-Mate RAST 2.5 Header, Vertical, 5 Circuits, Reference K00, Glow Wire

File Size 188.11K  /  4 Page

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Amphenol Communications Solutions

Part No. 98426-S04-07-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    71308-5448 0713085448

Molex Electronics Ltd.
Part No. 71308-5448 0713085448
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 48 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB LocatorPegs

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z2054071301
Description QSFP 2X2 COMBO SP FG NO LP
Tech specs    

Official Product Page

    0713492028

Molex Electronics Ltd.
Part No. 0713492028
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded60 Circuits, Tin (Sn) Plating, with Press-fit Plastic Pegs
MOLEX Connector

File Size 420.41K  /  5 Page

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Amphenol Communications Solutions

Part No. 98426-G04-07-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0713492080

Molex Electronics Ltd.
Part No. 0713492080
Description MOLEX Connector

File Size 420.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 66207-136LF
Description Quickie® IDC Cable-to-Board Connector System, Eject Latch Header, Vertical, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For HG-0713 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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