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  LFCN-1800 Datasheet PDF File

For LFCN-1800 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    NTE[NTE Electronics]
Part No. RX1800-18
Description MATERIAL SAFETY DATA SHEET

File Size 109.65K  /  6 Page

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Rochester Electronics LLC

Part No. EP1800ILC-70
Description EP1800 - Classic Family EPLD
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Winchester Electronics Corporation
Part No. SD1800-4
Description ATTENUATOR, 3 dB 2W ,TNC

File Size 72.55K  /  1 Page

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Rochester Electronics LLC

Part No. EP1800GM-75/B
Description EP1800 - Classic Family EPLD
Tech specs    

Official Product Page

   
Part No. D1800N
Description 2450 A, 3200 V, SILICON, RECTIFIER DIODE

File Size 133.56K  /  4 Page

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Amphenol Communications Solutions

Part No. 10120818-001CLF
Description SAS 3.0 Connectors, Storage & Server System, Receptacle, Vertical, Surface Mount, 29 Positions, 12Gb/s.
Tech specs    

Official Product Page

    162-10-428-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-428-00-180000
Description DIP Header Solder Tail Shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.38K  /  2 Page

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Amphenol Communications Solutions

Part No. 10127718-002PLF
Description Minitek® Pwr 3.0, Receptacle Terminal, Gold Flash, Preplating.
Tech specs    

Official Product Page

    162-10-430-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-430-00-180000
Description DIP Header Solder Tail Shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.39K  /  2 Page

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Amphenol Communications Solutions

Part No. 71918-008LF
Description Quickie Eject Latch Shrouded Header, Through Hole, Vertical, Double Row, 8 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    162-10-648-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-648-00-180000
Description DIP Header Solder Tail Shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.38K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-809071800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 7 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    162-10-316-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-316-00-180000
Description DIP Header Solder Tail Shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.38K  /  2 Page

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Amphenol Communications Solutions

Part No. 87180-086LF
Description Modular Jack, CAT 3, Low Profile, 8P6C, Right Angle, Through Mount, Without Shield, Snap Peg, 1 Port
Tech specs    

Official Product Page

    162-10-640-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-640-00-180000
Description DIP Header Solder Tail Shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.39K  /  2 Page

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Amphenol Communications Solutions

Part No. 54242-108261800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    162-10-620-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-620-00-180000
Description DIP Header Solder Tail Shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.37K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-110161800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    162-10-628-00-180000

Mill-Max Mfg. Corp.
Part No. 162-10-628-00-180000
Description DIP Header Solder Tail Shrink DIP (.070 Spacing) Open Frame Through Hole

File Size 217.37K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-109141800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For LFCN-1800 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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