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				Samsung Electronic SAMSUNG[Samsung semiconductor] SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	S524A40X21 S524A40X41 S524A60X51 S524A60X81 S524A40X11 S524A60X81-RI S524A40X41-DI
OCR Text	... bus. Any device that puts data onto the bus is defined as the "transmitter" and any device that gets data from the bus is the "receiver." The bus is controlled by a master device which generates the serial clock and start/stop conditions, ...
Description	1K/2K/4K/8K/16K-bit Serial EEPROM for Low Power 1K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8 512 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8
File Size	123.14K / 16 Page	View it Online	Download Datasheet

				Samsung Electronic SAMSUNG[Samsung semiconductor]
Part No.	S524A40X10 S524A40X40 S524A40X20
OCR Text	... bus. Any device that puts data onto the bus is defined as the "transmitter" and any device that gets data from the bus is the "receiver." The bus is controlled by a master device which generates the serial clock and start/stop conditions, ...
Description	1K/2K/4K-bit Serial EEPROM for Low Power with software write protect
File Size	131.07K / 18 Page	View it Online	Download Datasheet

				BITECH[Bi technologies]
Part No.	143
OCR Text	...Resistors are directly screened onto the substrate and other components are typically surface mounted. Chip and wire attachment is available for components where required. A variety of lead frame configurations are available to create SIP's...
Description	Custom Commercial Modules
File Size	119.00K / 3 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. PHILIPS[Philips Semiconductors]
Part No.	BGF1801-10
OCR Text	... with the dies directly mounted onto a copper flange. The matching and bias circuit components are mounted on a printed-circuit board (PCB), which is also soldered onto the copper flange. The dies and the PCB are encapsulated in a plastic c...
Description	GSM1800 EDGE power module 1805 MHz - 1880 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER
File Size	89.63K / 11 Page	View it Online	Download Datasheet

				Future Technology Devices International Ltd.
Part No.	FT245R
OCR Text	...clock circuit and USB resistors onto the device. The FT245R adds a new function compared with its predecessors, effectively making it a "2-in-1" chip for some application areas. A unique number (the FTDIChip-IDTM) is burnt into the device d...
Description	USB FIFO I.C. Incorporating FTDIChip-ID⑩ Security Dongle
File Size	444.34K / 25 Page	View it Online	Download Datasheet

				Mitsubishi Electric Sem... MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	RA07H4047M-101 RA07H4047M06 RA07H4047M_06 RA07H4047M
OCR Text	...f an alumina substrate soldered onto a copper flange. For mechanical protection, a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated with resin. Lines on t...
Description	RoHS Compliance ,400-470MHz 7W 12.5V, 2 Stage Amp. For PORTABLE RADIO
File Size	100.44K / 8 Page	View it Online	Download Datasheet

				Mitsubishi Electric Semicon... MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	RA07H4452M-101 RA07H4452M06 RA07H4452M_06 RA07H4452M
OCR Text	...f an alumina substrate soldered onto a copper flange. For mechanical protection, a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated with resin. Lines on t...
Description	RoHS Compliance ,440-520MHz 7W 12.5V, 2 Stage Amp. For PORTABLE RADIO
File Size	91.23K / 8 Page	View it Online	Download Datasheet

				Mitsubishi Electric Sem... MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	RA07N3340M-101 RA07N3340M06 RA07N3340M
OCR Text	...f an alumina substrate soldered onto a copper flange. For mechanical protection, a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated with resin. Lines on t...
Description	RoHS Compliance , 330-400MHz 7.5W 9.6V 2 Stage Amp. For PORTABLE RADIO
File Size	91.55K / 8 Page	View it Online	Download Datasheet

				Mitsubishi Electric Sem... Mitsubishi Electric Semiconductor Mitsubishi Electric Corporation
Part No.	RA07N3340M RA07N3340M-01
OCR Text	...f an alumina substrate soldered onto a copper flange. For mechanical protection, a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated with resin. Lines on t...
Description	330-400MHz 7.5W 9.6V 2 Stage Amp. For PORTABLE RADIO
File Size	82.45K / 9 Page	View it Online	Download Datasheet

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