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  THI3-0513 Datasheet PDF File

For THI3-0513 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    51336-1910 0513361910

Molex Electronics Ltd.
Part No. 51336-1910 0513361910
Description 1.25mm (.049) Pitch Mini Mi II System Wire-to-Board IDT Housing, Single Row, 19 Circuits

File Size 98.92K  /  2 Page

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Amphenol Communications Solutions

Part No. 68405-130HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0513820400 51382-0400

Molex Electronics Ltd.
Part No. 0513820400 51382-0400
Description 2.00mm (.079) Pitch MicroClasp?/a> Wire-to-Board Receptacle Housing, Positive Lock Single Row, 4 circuits
2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive Lock Single Row, 4 circuits

File Size 140.93K  /  3 Page

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Amphenol Communications Solutions

Part No. 68705-131HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 31 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51382-0200 0513820200

Molex Electronics Ltd.
Part No. 51382-0200 0513820200
Description 2.00mm (.079) Pitch MicroClasp?/a> Wire-to-Board Receptacle Housing, Positive LockSingle Row, 2 circuits
2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive LockSingle Row, 2 circuits

File Size 141.11K  /  3 Page

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Amphenol Communications Solutions

Part No. U95Z2454051301
Description ULTQSFP 2X2 COMBO 4LP&SPFG
Tech specs    

Official Product Page

    51382-0700 0513820700

Molex Electronics Ltd.
Part No. 51382-0700 0513820700
Description 2.00mm (.079) Pitch MicroClasp?/a> Wire-to-Board Receptacle Housing, Positive Lock,Single Row, 7 circuits

File Size 140.92K  /  3 Page

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Amphenol Communications Solutions

Part No. 98426-G04-05-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    51348-0213 0513480213

Molex Electronics Ltd.
Part No. 51348-0213 0513480213
Description 3.30mm (.130) Pitch Wire-to-Wire Retainer, 2 Circuits

File Size 79.05K  /  2 Page

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Amphenol Communications Solutions

Part No. 73305-131LF
Description RJ45 Modular Jack, Input Output Connectors, CAT 3, Standard, 6P6C, Right Angle, Surface Mount, without Shield, 1 Port.
Tech specs    

Official Product Page

    0513820800 51382-0800

Molex Electronics Ltd.
Part No. 0513820800 51382-0800
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive Lock Single Row, 8 circuits

File Size 140.92K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-807051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0513820500 51382-0500

Molex Electronics Ltd.
Part No. 0513820500 51382-0500
Description 2.00mm (.079) Pitch MicroClasp?/a> Wire-to-Board Receptacle Housing, Positive Lock Single Row, 5 circuits
2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive Lock Single Row, 5 circuits

File Size 140.93K  /  3 Page

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Amphenol Communications Solutions

Part No. DDR4288S0513VF
Description DDR4 Memory Module Sockets, Storage and Server System, Surface Mount, 288 Position, 0.85mm (0.0335in) pitch.
Tech specs    

Official Product Page

    0513820300 51382-0300

Molex Electronics Ltd.
Part No. 0513820300 51382-0300
Description 2.00mm (.079) Pitch MicroClasp?/a> Wire-to-Board Receptacle Housing, Positive Lock,Single Row, 3 circuits
2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive Lock,Single Row, 3 circuits

File Size 140.93K  /  3 Page

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Amphenol Communications Solutions

Part No. 68705-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51353-4000 0513534000

Molex Electronics Ltd.
Part No. 51353-4000 0513534000
Description 2.00mm (.079) Pitch MicroClasp?/a> Wire-to-Board Receptacle Housing, Positive LockDual Row, 40 circuits
2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive LockDual Row, 40 circuits

File Size 242.12K  /  3 Page

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Amphenol Communications Solutions

Part No. 54121-407051300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    51353-3800 0513533800

Molex Electronics Ltd.
Part No. 51353-3800 0513533800
Description 2.00mm (.079) Pitch MicroClasp Wire-to-Board Receptacle Housing, Positive Lock Dual Row, 38 circuits

File Size 242.13K  /  3 Page

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Amphenol Communications Solutions

Part No. 10120513-002C-TRLF
Description SAS/PCIe 3.0 (U.2) Connectors, Storage and Server Connector, 68 Position Vertical Recep SMT, 12Gb/s.
Tech specs    

Official Product Page

For THI3-0513 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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