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  TIM-5510 Datasheet PDF File

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    Toshiba Corporation
Part No. TIM6472-4UL
Description MICROWAVE POWER GaAs FET

File Size 45.02K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1109LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TIM5359-8 TIM5359-8SL

Toshiba Semiconductor
Part No. TIM5359-8 TIM5359-8SL
Description MICROWAVE POWER GaAs FET
   MICROWAVE POWER GaAs FET

File Size 155.13K  /  8 Page

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Amphenol Communications Solutions

Part No. 55102-G1110LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Toshiba Corporation
Part No. TIM1414-5-252
Description POWER GAAS FET

File Size 116.92K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1108LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Toshiba Corporation
Part No. TIM6472-8UL
Description MICROWAVE POWER GaAs FET

File Size 44.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-G17-04
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Toshiba Corporation
Part No. TIM1011-15L
Description P1dB=42.0dBm at 10.7GHz to 11.7GHz

File Size 458.62K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1104LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM1414-4LA

Toshiba Semiconductor
Part No. TIM1414-4LA
Description
File Size 84.72K  /  2 Page

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Amphenol Communications Solutions

Part No. 55101-T1113LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

    TIM1414-4LA

Toshiba Semiconductor
Part No. TIM1414-4LA
Description MICROWAVE POWER GaAs FET

File Size 244.98K  /  2 Page

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Amphenol Communications Solutions

Part No. 55102-G1703LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM4450-8UL

Toshiba Semiconductor
Part No. TIM4450-8UL
Description HIGH POWER P1dB=39.5dBm at 4.4GHz to 5.0GHz

File Size 117.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-S3620LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM7179-6UL

Toshiba Semiconductor
Part No. TIM7179-6UL
Description HIGH POWER P1dB=38.5dBm at 7.1GHz to 7.9GHz

File Size 116.72K  /  4 Page

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Amphenol Communications Solutions

Part No. 55102-T17-22
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM7179-4UL

Toshiba Semiconductor
Part No. TIM7179-4UL
Description HIGH POWER P1dB=36.5dBm at 7.1GHz to 7.9GHz

File Size 116.88K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-G1715LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 15 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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