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  090663-1303 Datasheet PDF File

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    71308-4230N 015-91-1303

Molex Electronics Ltd.
Part No. 71308-4230N 015-91-1303
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs
File Size 1,475.63K  /  8 Page

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Amphenol Communications Solutions
Part No. 130-3142-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    Winson Semiconductor Co...
Part No. WCS1303
Description Hall Effect Base Current Switch
File Size 401.00K  /  4 Page

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Amphenol Communications Solutions
Part No. 130-3162-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    MT1303A-UR-A

Marktech Corporate
Part No. MT1303A-UR-A
Description 3.0mm ROUND LED LAMP
File Size 176.04K  /  6 Page

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Amphenol Communications Solutions
Part No. 130-3142-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    MAX1303

Maxim Integrated Products
Part No. MAX1303
Description The MAX1302/MAX1303 multirange, low-power, 16-bit, successive-approximation, analog-to-digital conve
File Size 755.55K  /  31 Page

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Amphenol Communications Solutions
Part No. 130-3182-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, APP.
Tech specs 　 　

Official Product Page

    Solomon
Part No. SSD1303
Description 132 x 64 Dot Matrix OLED/PLED Segment/Common Driver
File Size 656.60K  /  56 Page

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Amphenol Communications Solutions
Part No. 130-3162-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, APP.
Tech specs 　 　

Official Product Page

    PEM1303

List of Unclassifed Manufacturers
Part No. PEM1303
Description Power Over Ethernet PD Module
File Size 713.45K  /  5 Page

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Amphenol Communications Solutions
Part No. 130-3142-15H
Description Paladin Plus 3-Pair, 4 Column, Right Angle Receptacle, Signal Module, APP
Tech specs 　 　

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. BA01303
Description Triple Band(EGSM900/DCS1800/PCS1900) InGaP HBT Front-end module
File Size 84.26K  /  3 Page

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Amphenol Communications Solutions
Part No. 130-3182-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    Panasonic Corporation
PANASONIC[Panasonic Semiconductor]
Part No. CNB1303
Description Reflective Photosensor
File Size 47.81K  /  2 Page

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Amphenol Communications Solutions
Part No. 130-3142-15D
Description Paladin Plus 3-Pair, 4 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs 　 　

Official Product Page

    OTS-1REFR-B5-SA-IC OTS-1REFT-B5-1306-SA-IC OTS-1LT-B5-1303-SA-IC OTS-1LT-B7-1303-SA-IC OTS-1LT-S5-1303-SA-IC OTS-1LR-S5-

Emcore Corporation
Part No. OTS-1REFR-B5-SA-IC OTS-1REFT-B5-1306-SA-IC OTS-1LT-B5-1303-SA-IC OTS-1LT-B7-1303-SA-IC OTS-1LT-S5-1303-SA-IC OTS-1LR-S5-SA-IC OTS-1LR-B5-SA-IC OTS-1LR-B7-SA-IC
Description Reference Oscillator Link
File Size 200.85K  /  2 Page

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Amphenol Communications Solutions
Part No. 130-3182-15H
Description Paladin Plus 3-Pair, 8 Column, Right Angle Receptacle, Signal Module, APP
Tech specs 　 　

Official Product Page

    AM-8702 ENA1303

Sanyo Semicon Device
Part No. AM-8702 ENA1303
Description Amorphous Solar Cell
File Size 31.94K  /  2 Page

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Amphenol Communications Solutions
Part No. 130-3162-15D
Description Paladin Plus 3-Pair, 6 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs 　 　

Official Product Page

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