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  160-2141 Datasheet PDF File

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    0908972141

Molex Electronics Ltd.
Part No. 0908972141
Description 2.54mm (.100) Pitch QF-50, Right Angle, Dual Row with Eject Levers, Shrouded Header
File Size 257.68K  /  3 Page

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Amphenol Communications Solutions
Part No. 10137785-052141LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Gold Flash plating, Natural Color, 5 Positions, Non GW Compatible, with Post, Tray packing.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    55932-1410 0559321410

Molex Electronics Ltd.
Part No. 55932-1410 0559321410
Description 2.00mm (.079) Pitch MicroClasp?/a> Wire-to-Board Header, Single Row, Vertical, 14 Circuits, with PCB Locator
2.00mm (.079) Pitch MicroClasp Wire-to-Board Header, Single Row, Vertical, 14 Circuits, with PCB Locator
File Size 128.03K  /  4 Page

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Amphenol Communications Solutions
Part No. 54121-410041600LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0022182141 22-18-2141

Molex Electronics Ltd.
Part No. 0022182141 22-18-2141
Description 2.54mm (.100) Pitch KK? PC Board Connector, Top Entry, with Cat Ear Terminal, 0.38μm (15μ) Gold (Au), 14 Circuits, With Hooks
MOLEX Connector
File Size 621.15K  /  17 Page

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Amphenol Communications Solutions
Part No. 54121-419041650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    22-55-2201 22-55-2221 22-55-2241 22-55-2261 22-55-2101 22-55-2121 22-55-2141 22-55-2181 22-55-2041 22-55-2061 22-55-2081

Molex Electronics Ltd.
Part No. 22-55-2201 22-55-2221 22-55-2241 22-55-2261 22-55-2101 22-55-2121 22-55-2141 22-55-2181 22-55-2041 22-55-2061 22-55-2081 22-55-2161
Description HOUSING - CONNECTOR DUAL ROW
File Size 88.29K  /  1 Page

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Amphenol Communications Solutions
Part No. 91910-21415LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Header, Surface Mount, 15 Positions, 1.00mm ( 0.039in) Pitch.
Tech specs 　 　

Official Product Page

    Panasonic
Part No. DB2141200L
Description Schottky Barrier Diodes
File Size 193.84K  /  5 Page

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Amphenol Communications Solutions
Part No. 91900-21411LF
Description Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Conan Vertical Header, Surface Mount, 11 Positions, 1.00mm (0.039in) Pitch
Tech specs 　 　

Official Product Page

    0741621412 74162-1412

Molex Electronics Ltd.
Part No. 0741621412 74162-1412
Description 2.54mm (.100) Pitch C-Grid? Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version B, High-Temperature, 12 Circuits, 0.8μm (30μ) Gold (Au)
File Size 1,304.58K  /  10 Page

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Amphenol Communications Solutions
Part No. 61082-141402LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
Tech specs 　 　

Official Product Page

    0741621410

Molex Electronics Ltd.
Part No. 0741621410
Description 2.54mm (.100) Pitch C-Grid? Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version B, High-Temperature, 10 Circuits, 0.8μm (30μ) Gold (Au)
File Size 1,304.58K  /  10 Page

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Amphenol Communications Solutions
Part No. 79821-412HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 12 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs 　 　

Official Product Page

    0741621414 74162-1414

Molex Electronics Ltd.
Part No. 0741621414 74162-1414
Description 2.54mm (.100) Pitch C-Grid Receptacle, Right Angle, Through Hole, Dual Row, Shrouded, Version B
File Size 1,304.58K  /  10 Page

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Amphenol Communications Solutions
Part No. 54121-416063050LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    Panasonic Battery Group
Part No. DB2141200L
Description Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
File Size 314.71K  /  5 Page

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Amphenol Communications Solutions
Part No. 131-3214-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    DB2141300L

Panasonic Semiconductor
Part No. DB2141300L
Description Silicon epitaxial planar type
File Size 314.85K  /  5 Page

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Amphenol Communications Solutions
Part No. 131-8214-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

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