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MICROSEMI[Microsemi Corporation]
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Part No. |
LX5512BLQ LX5512B LX5512BLQTR
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OCR Text |
...LX5512B is available in a 16pin 3mmx3mm micro-lead package (MLP). The compact footprint, low profile, and excellent thermal capability of LX5512B meets the requirements of high-gain power amplifiers for IEEE 802.11b/g applications.
WWW .... |
Description |
InGaP HBT 2.4 2.5 GHz Power Amplifier InGaP HBT 2.4-2.5 GHz power amplifier. InGaP HBT 2.4 - 2.5 GHz Power Amplifier
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File Size |
173.40K /
6 Page |
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it Online |
Download Datasheet
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MICROSEMI[Microsemi Corporation]
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Part No. |
LX5506
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OCR Text |
...LX5506 is available in a 16-pin 3mmx3mm micro-lead package (MLP). The compact footprint, low profile, and excellent thermal capability of the MLP package makes the LX5506 an ideal solution for broadband, high-gain power amplifier requiremen... |
Description |
InGaP HBT 4.5 - 6GHz Power Amplifier
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File Size |
496.83K /
10 Page |
View
it Online |
Download Datasheet
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Price and Availability
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