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Molex Electronics Ltd.
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Part No. |
75757-0231 0757570231
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail, 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail,
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File Size |
99.21K /
3 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54122-110161800LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
75757-0242 0757570242
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
86130161024345E1LF
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Description |
8613 M CNR LF
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
75757-0252 0757570252
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54122-410161400LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10127720-161LF
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Description |
Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 16 Positions, 100u\\ Tin plating, Non GW Compatible LCP, With Pegs, Tray Packing.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68016-126HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 26 Positions, 2.54 mm (0.100) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10121506-001612ALF
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Description |
HPCE STD VT Receptacle 16P12S
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68016-101HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
75757-0262 0757570262
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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File Size |
99.22K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
51741-10001616AALF
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Description |
PwrBlade®, Power Supply Connectors, 16S 16P Vertical Receptacle.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
75757-0261 0757570261
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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File Size |
99.22K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
12401610E4#2A
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Description |
USB3.2 GEN2, Type C, Top mount, CH 1.58mm, Dual Row SMT
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
75757-0341 0757570341
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Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54122-120161840LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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