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  75757-5161 Datasheet PDF File

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    75757-6201 0757576201

Molex Electronics Ltd.
Part No. 75757-6201 0757576201
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 51617-XX002LF
Description PwrBlade®, Power Supply Connectors, 5P 24S 1M 7P PF Vertical Receptacle.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0757571261

Molex Electronics Ltd.
Part No. 0757571261
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, Gold (Au) Flash Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 84516-102
Description 200 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    75757-0122 0757570122

Molex Electronics Ltd.
Part No. 75757-0122 0757570122
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25um (50u) Nickel (Ni) Overall

File Size 98.93K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-3516-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0757571201 75757-1201

Molex Electronics Ltd.
Part No. 0757571201 75757-1201
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, Gold (Au) Flash Plating
3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, Gold (Au) Flash Plating

File Size 166.56K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8516-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0757571181 75757-1181

Molex Electronics Ltd.
Part No. 0757571181 75757-1181
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 16 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150垄芒 Header, Breakaway, Vertical, 16 Circuits, 2.5楼矛m (100楼矛) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length

File Size 166.63K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-7516-11H
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0757571161 75757-1161

Molex Electronics Ltd.
Part No. 0757571161 75757-1161
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length
3.50mm (.138) Pitch, MX150垄芒 Header, Breakaway, Vertical, 12 Circuits, 2.5楼矛m (100楼矛) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length

File Size 166.64K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-516122300LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0757571141 75757-1141

Molex Electronics Ltd.
Part No. 0757571141 75757-1141
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150垄芒 Header, Breakaway, Vertical, 8 Circuits, 2.5楼矛m (100楼矛) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail L

File Size 166.64K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-7516-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0757571131 75757-1131

Molex Electronics Ltd.
Part No. 0757571131 75757-1131
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150垄芒 Header, Breakaway, Vertical, 6 Circuits, 2.5楼矛m (100楼矛) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail L

File Size 166.83K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-6516-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    75757-0142 0757570142

Molex Electronics Ltd.
Part No. 75757-0142 0757570142
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits

File Size 99.17K  /  3 Page

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Amphenol Communications Solutions

Part No. F516-1A7H1-21014
Description Flex Connector, 1.00mm Pitch, Height 2.00mm, Right angle, Flip type, ZIF, 14 position, With MYLAR
Tech specs    

Official Product Page

    0757570152 75757-0152

Molex Electronics Ltd.
Part No. 0757570152 75757-0152
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25um (50u) Nickel (Ni) Overall
MOLEX Connector

File Size 99.39K  /  3 Page

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Amphenol Communications Solutions

Part No. 10137925-1612LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 16 Positions, Non GW Compatible LCP, Tape and Reel. .
Tech specs    

Official Product Page

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