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  90130-1238 Datasheet PDF File

For 90130-1238 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    0901301132 90130-1132

Molex Electronics Ltd.
Part No. 0901301132 90130-1132
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 32 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.90K  /  7 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90130-1268 0901301268

Molex Electronics Ltd.
Part No. 90130-1268 0901301268
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 68 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 68 Circuits, Black 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 578.23K  /  7 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    0901301114 90130-1114

Molex Electronics Ltd.
Part No. 0901301114 90130-1114
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 14 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    0901301112 90130-1112

Molex Electronics Ltd.
Part No. 0901301112 90130-1112
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    0901301110 90130-1110

Molex Electronics Ltd.
Part No. 0901301110 90130-1110
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.90K  /  7 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0901301108 90130-1108

Molex Electronics Ltd.
Part No. 0901301108 90130-1108
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 8 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.90K  /  7 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901301106 90130-1106

Molex Electronics Ltd.
Part No. 0901301106 90130-1106
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded 6 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 10123844-001LF
Description HPCE R/A Receptacle 4P16S (8S Omitted)
Tech specs    

Official Product Page

    0510901300 51090-1300

Molex Electronics Ltd.
Part No. 0510901300 51090-1300
Description 2.00mm (.079) Pitch Mi II?/a> System Wire-to-Board Crimp Housing, Single Row, 13Circuits
2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Single Row, 13Circuits

File Size 87.21K  /  2 Page

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Amphenol Communications Solutions

Part No. GSB3112380F1HR
Description USB 3.2, Type A, Receptacle, Right Angle Stacked Short Body, 18 Pins, Shell Kink with Nickel Plating, 30u\\ Gold, Dip 2.17mm, Black High Temperature Housing, Tray Packaging
Tech specs    

Official Product Page

    0901303120

Molex Electronics Ltd.
Part No. 0901303120
Description
File Size 168.44K  /  4 Page

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Amphenol Communications Solutions

Part No. 77317-412-38LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

    0901303350

Molex Electronics Ltd.
Part No. 0901303350
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 50 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 224.10K  /  4 Page

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Amphenol Communications Solutions

Part No. 77317-812-38LF
Description BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 38 Positions ,2.54mm (0.100in) Pitch,
Tech specs    

Official Product Page

For 90130-1238 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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