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  AMMP-6408 Datasheet PDF File

For AMMP-6408 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    K4S640832C K4S640832C-TC_L1L K4S640832C-TC_L70 K4S640832C-TC_L80 K4S640832C-TC_L1H K4S640832C-TC_L10 K4S640832C-TC/L10 K

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S640832C K4S640832C-TC_L1L K4S640832C-TC_L70 K4S640832C-TC_L80 K4S640832C-TC_L1H K4S640832C-TC_L10 K4S640832C-TC/L10 K4S640832C-TC/L1H K4S640832C-TC/L1L K4S640832C-TC/L70 K4S640832C-TC/L80
Description 64Mbit SDRAM 2M x 8Bit x 4 Banks Synchronous DRAM LVTTL
File Size 128.76K  /  11 Page

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Amphenol Communications Solutions
Part No. 87606-408LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 16 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    K4S640832D K4S640832D-TC_L10 K4S640832D-TC_L1H K4S640832D-TC_L1L K4S640832D-TC_L80 K4S640832D-TC_L75 K4S640832D-TC/L10 K

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S640832D K4S640832D-TC_L10 K4S640832D-TC_L1H K4S640832D-TC_L1L K4S640832D-TC_L80 K4S640832D-TC_L75 K4S640832D-TC/L10 K4S640832D-TC/L1H K4S640832D-TC/L1L K4S640832D-TC/L75 K4S640832D-TC/L80
Description 64Mbit SDRAM 2M x 8Bit x 4 Banks Synchronous DRAM LVTTL
File Size 127.15K  /  10 Page

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Amphenol Communications Solutions
Part No. 54122-811640800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 64 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    K9F6408U0A-TCB0 K9F6408U0A-TIB0

SAMSUNG[Samsung semiconductor]
Samsung Electronics Inc
Part No. K9F6408U0A-TCB0 K9F6408U0A-TIB0
Description From old datasheet system
EEPROM,NAND FLASH,8MX8,CMOS,TSOP,44PIN,PLASTIC
8M x 8 Bit NAND Flash Memory
File Size 344.78K  /  26 Page

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Amphenol Communications Solutions
Part No. 54122-806640800LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 64 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F6408U0M-TCB0 K9F6408U0M-TIB0
Description 8M x 8 Bit NAND Flash Memory
File Size 483.65K  /  26 Page

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Amphenol Communications Solutions
Part No. 51761-10006408CBLF
Description PwrBlade®, Power Supply Connectors, 64S 8P PF Right Angle Receptacle.
Tech specs 　 　

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K9F6408U0B-TIB0 K9F6408U0B-TCB0
Description 8M x 8 Bit NAND Flash Memory 8米8位NAND闪存
File Size 418.95K  /  27 Page

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Amphenol Communications Solutions
Part No. 68466-408HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 8 Positions, 2.54 mm Pitch, Vertical, 17.7 mm (0.697 in.) Mating, 3.25 mm (0.128 in.) Tail
Tech specs 　 　

Official Product Page

    K9F6408U0B K9F6408U0B-TCB0 K9F6408U0B-TIB0

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K9F6408U0B K9F6408U0B-TCB0 K9F6408U0B-TIB0
Description 8M x 8 Bit NAND Flash Memory
File Size 412.99K  /  27 Page

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Amphenol Communications Solutions
Part No. 67996-408-158028LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    K9F6408U0M-TCB0 K9F6408U0M-TIB0

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K9F6408U0M-TCB0 K9F6408U0M-TIB0
Description 8M x 8 Bit NAND Flash Memory
File Size 477.87K  /  26 Page

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Amphenol Communications Solutions
Part No. 51701-10006408CCLF
Description PwrBlade®, Power Supply Connectors, 64S 8P PF Vertical Header.
Tech specs 　 　

Official Product Page

   
Part No. K9F6408U0B-TCB00
Description
File Size 507.48K  /  27 Page

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Amphenol Communications Solutions
Part No. 91276-408HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 8 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
Tech specs 　 　

Official Product Page

    K4S640832 K4S640832F K4S640832F-TL75 K4S640832F-TC75

SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Electronics Inc
Part No. K4S640832 K4S640832F K4S640832F-TL75 K4S640832F-TC75
Description Advanced LinCMOS(TM) Low-Noise Precision Operational Amplifier 8-SOIC 0 to 70
64Mbit SDRAM 2M x 8Bit x 4 Banks Synchronous DRAM LVTTL
IC,SDRAM,4X2MX8,CMOS,TSOP,54PIN,PLASTIC
File Size 116.51K  /  11 Page

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Amphenol Communications Solutions
Part No. 87916-408HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 8 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
Tech specs 　 　

Official Product Page

   
Part No. K4F640812D-JI45 K4F640812D-JP45
Description 8M X 8 FAST PAGE DRAM, 45 ns, PDSO32
File Size 175.15K  /  20 Page

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Amphenol Communications Solutions
Part No. 87606-408HLF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 16 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

For AMMP-6408 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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