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  BFCN-8000 Datasheet PDF File

For BFCN-8000 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

   
Part No. 80000 80022
Description KIT HELVETICA BLACK 25MM
1.0A Sngl MOSFET Drvr, Inv, 0C to 70C, 8-SOIC 150mil, TUBE

File Size 188.25K  /  1 Page

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Amphenol Communications Solutions

Part No. 68000-401HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Siemens Semiconductor
Part No. Q68000
Description NPN Silicon AF Transistors

File Size 152.06K  /  5 Page

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Part No. CE1208000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 2 power pins, 80 signal pins, Vertical
Tech specs    

Official Product Page

    304-11-114-41-780000

Mill-Max Mfg. Corp.
Part No. 304-11-114-41-780000
Description    Interconnect Socket Solderless Press-Fit Socket

File Size 128.37K  /  3 Page

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Amphenol Communications Solutions

Part No. 68000-232HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    304-11-107-41-780000

Mill-Max Mfg. Corp.
Part No. 304-11-107-41-780000
Description    Interconnect Socket Solderless Press-Fit Socket

File Size 128.37K  /  3 Page

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Amphenol Communications Solutions

Part No. 68000-434HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    304-11-109-41-780000

Mill-Max Mfg. Corp.
Part No. 304-11-109-41-780000
Description    Interconnect Socket Solderless Press-Fit Socket

File Size 128.59K  /  3 Page

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Amphenol Communications Solutions

Part No. 68000-119HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    304-11-106-41-780000

Mill-Max Mfg. Corp.
Part No. 304-11-106-41-780000
Description    Interconnect Socket Solderless Press-Fit Socket

File Size 128.37K  /  3 Page

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Amphenol Communications Solutions

Part No. 68000-403HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 3 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    SI-8000Q SI-8005Q

Sanken electric
Part No. SI-8000Q SI-8005Q
Description Surface Mount, Current Mode Cntrol Step-down Switching Mode

File Size 61.22K  /  2 Page

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Amphenol Communications Solutions

Part No. 68000-228HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    304-11-105-41-780000

Mill-Max Mfg. Corp.
Part No. 304-11-105-41-780000
Description    Interconnect Socket Solderless Press-Fit Socket

File Size 128.37K  /  3 Page

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Part No. 10035388-000LF
Description Power Card Edge, Power Connectors, 2 x 29P STB Right Angle.
Tech specs    

Official Product Page

    304-11-101-41-780000

Mill-Max Mfg. Corp.
Part No. 304-11-101-41-780000
Description    Interconnect Socket Solderless Press-Fit Socket

File Size 128.37K  /  3 Page

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Amphenol Communications Solutions

Part No. 68000-123HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 23 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    304-11-112-41-780000

Mill-Max Mfg. Corp.
Part No. 304-11-112-41-780000
Description    Interconnect Socket Solderless Press-Fit Socket

File Size 128.37K  /  3 Page

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Amphenol Communications Solutions

Part No. 68000-101HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

For BFCN-8000 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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