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  CEP-1162 Datasheet PDF File

For CEP-1162 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

   
Part No. CEP71A3
Description 30V N Channel MOS

File Size 50.10K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. 2SA1162
Description PNP Bipolar Transistor / VCEO=-50 V / IC=-0.15 A / hFE=70~400 / VCE(sat)=-0.3 V / AEC-Q101 / SOT-346
Tech specs    

Official Product Page

HUA FENG CIRCUIT





   
Part No. CEP72A3
Description 30V N Channel MOS

File Size 50.58K  /  5 Page

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Amphenol Communications Solutions

Part No. 79821-162HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 62 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs    

Official Product Page

    CET
Part No. CEP658N
Description N-Channel Enhancement Mode Field Effect Transistor

File Size 267.14K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-5116-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    CEP710B

Sumida Corporation
Part No. CEP710B
Description ADSL TransformerADSL Transformer Type: CEP Series

File Size 111.89K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-4116-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    CET
Part No. CEP83A3
Description N-Channel Enhancement Mode Field Effect Transistor

File Size 98.74K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-162-36LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

   
Part No. CEP10N4
Description 450V N Channel MOS 450V 频道马鞍

File Size 41.08K  /  5 Page

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Amphenol Communications Solutions

Part No. 10127721-162GLF
Description Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 16 Position, 3.2mm Kink Tail (Gold Flash) plating, GW Compatible LCP, Black Color,Tray Packing.
Tech specs    

Official Product Page

    ICEPIC3

rfsolutions.ltd
Part No. ICEPIC3
Description MODULAR, REAL TIME EMULATOR SYSTEM FOR

File Size 292.54K  /  4 Page

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Amphenol Communications Solutions

Part No. 75168-116-20LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ICEPIC2

rfsolutions.ltd
Part No. ICEPIC2
Description MODULAR, REAL TIME EMULATOR SYSTEM FOR ALL PIC隆炉s
MODULAR, REAL TIME EMULATOR SYSTEM FOR ALL PIC’s

File Size 311.95K  /  2 Page

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Amphenol Communications Solutions

Part No. 54242-811162350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    CEP99P2

Sumida Corporation
Part No. CEP99P2
Description DA1522-306

File Size 369.56K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-3116-21D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    CEP6042

Chino-Excel Technology
Part No. CEP6042
Description    N-Channel Enhancement Mode Field Effect Transistor

File Size 420.13K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-8116-21D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For CEP-1162 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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