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  CPE-260H Datasheet PDF File

For CPE-260H Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    Rohm Co., Ltd.
MACOM[Tyco Electronics]
Part No. MACPES0004
Description E-Series 75 Ohm Coupler 5 - 870 MHZ E系列75欧姆耦合5 - 870兆赫

File Size 61.37K  /  2 Page

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Amphenol Communications Solutions

Part No. 69192-260HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    D945GCPE D98324-001US

Intel Corporation
Part No. D945GCPE D98324-001US
Description Technical Product Specification

File Size 3,070.95K  /  80 Page

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Amphenol Communications Solutions

Part No. 67997-260HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

   
Part No. MRF8S19260HSR6
Description
File Size 481.23K  /  14 Page

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Amphenol Communications Solutions

Part No. 68021-260HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MC-4R192CPE6C MC-4R192CPE6C-653 MC-4R192CPE6C-745 MC-4R192CPE6C-845

http://
NEC[NEC]
NEC Corp.
Part No. MC-4R192CPE6C MC-4R192CPE6C-653 MC-4R192CPE6C-745 MC-4R192CPE6C-845
Description Direct Rambus DRAM RIMM Module 192M-BYTE 96M-WORD x 16-BIT

File Size 130.93K  /  16 Page

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Amphenol Communications Solutions

Part No. 67997-260H
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 60Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    MC-4R256CPE6C-653 MC-4R256CPE6C-745 MC-4R256CPE6C-845

http://
Elpida Memory
Part No. MC-4R256CPE6C-653 MC-4R256CPE6C-745 MC-4R256CPE6C-845
Description Direct Rambus?/a> DRAM RIMM?/a> Module 256M-BYTE (128M-WORD x 16-BIT)
Direct Rambus DRAM RIMM Module 256M-BYTE (128M-WORD x 16-BIT)
Direct Rambus垄芒 DRAM RIMM垄芒 Module 256M-BYTE (128M-WORD x 16-BIT)

File Size 164.01K  /  16 Page

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Amphenol Communications Solutions

Part No. 69133-260HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MC-4R128CPE6C-653 MC-4R128CPE6C-745 MC-4R128CPE6C-845

ELPIDA MEMORY INC
Part No. MC-4R128CPE6C-653 MC-4R128CPE6C-745 MC-4R128CPE6C-845
Description 64M X 16 DIRECT RAMBUS DRAM MODULE, 1.5 ns, DMA184
Direct Rambus DRAM RIMM Module 128M-BYTE (64M-WORD x 16-BIT)
Direct Rambus垄芒 DRAM RIMM垄芒 Module 128M-BYTE (64M-WORD x 16-BIT)

File Size 163.92K  /  16 Page

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Amphenol Communications Solutions

Part No. 68464-260HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Performance Semiconductor, Corp.
NEC Corp.
NEC[NEC]
Part No. MC-4R128CPE6C-845 MC-4R128CPE6C MC-4R128CPE6C-653 MC-4R128CPE6C-745
Description 64M X 16 DIRECT RAMBUS DRAM MODULE, 45 ns, DMA184 RIMM-184
Direct Rambus DRAM RIMM Module 128M-BYTE 64M-WORD x 16-BIT

File Size 130.38K  /  16 Page

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Amphenol Communications Solutions

Part No. 67996-260HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    http://
NEC[NEC]
NEC Corp.
Performance Semiconductor, Corp.
Part No. MC-4R256CPE6C-845 MC-4R256CPE6C MC-4R256CPE6C-653 MC-4R256CPE6C-745
Description Direct Rambus DRAM RIMM Module 256M-BYTE 128M-WORD x 16-BIT
128M X 16 DIRECT RAMBUS DRAM MODULE, 45 ns, DMA184 RIMM-184

File Size 130.19K  /  16 Page

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Amphenol Communications Solutions

Part No. 68022-260HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    MRF8S9260HR3 MRF8S9260HSR3

Freescale Semiconductor, Inc
Part No. MRF8S9260HR3 MRF8S9260HSR3
Description RF Power Field Effect Transistors N-Channel Enhancement-Mode Lateral MOSFETs

File Size 302.27K  /  14 Page

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Amphenol Communications Solutions

Part No. 67998-260HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 60 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 2.72 mm (0.107 in.) Tail
Tech specs    

Official Product Page

    MRF8S8260HR3 MRF8S8260HSR3

Freescale Semiconductor, Inc
Part No. MRF8S8260HR3 MRF8S8260HSR3
Description RF Power Field Effect Transistors

File Size 573.96K  /  14 Page

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Amphenol Communications Solutions

Part No. 68020-260HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 60 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For CPE-260H Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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